A kind of acetic acid series ITO etchant and preparation technology
A preparation process and etching solution technology, applied in the direction of surface etching composition, chemical instruments and methods, etc., can solve the problems of strong corrosion ability, difficulty in controlling etching angle and etching time, high risk of operators and client equipment, etc. Achieve the effect of stable reaction, moderate rate and strong singleness
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Embodiment 1
[0026] The invention relates to an acetic acid-based ITO etching solution, which can be uniformly prepared from four raw materials: hydrochloric acid, acetic acid, potassium chloride and pure water.
[0027] Wherein, the percentage by weight of each raw material in the four kinds of raw materials can be respectively: hydrochloric acid 23%, acetic acid 7%, potassium chloride 0.3%, and the rest is pure water; when the purity of raw materials changes, its proportioning should be adjusted . The concentrations of the hydrochloric acid and the acetic acid can be respectively: 37% hydrochloric acid and 99.8% acetic acid; the purity of the potassium chloride can be 98%. The rest of the impurity components in the potassium chloride raw material are sodium chloride, water and a very small amount of impurities insoluble in the etching solution.
[0028] Wherein, in the acetic acid-based ITO etching solution, there are no more than 100 particles with a particle size greater than 0.3 μm p...
Embodiment 2
[0042] The invention relates to an acetic acid-based ITO etching solution, which can be uniformly prepared from four raw materials: hydrochloric acid, acetic acid, potassium chloride and pure water.
[0043] Wherein, the percentage by weight of each raw material in the four kinds of raw materials can be respectively: hydrochloric acid 24%, acetic acid 8%, potassium chloride 0.4%, and the rest is pure water; when the purity of raw materials changes, its proportioning should be adjusted .
[0044] Wherein, the concentrations of the hydrochloric acid and the acetic acid can be respectively: 37% hydrochloric acid and 99.8% acetic acid; the purity of the potassium chloride can be 98.5%.
[0045] Wherein, in the acetic acid-based ITO etching solution, there are no more than 100 particles with a particle size greater than 0.3 μm per 100 kg, impurity anions are no more than 30 ppb, and impurity cations are no more than 0.05 ppb.
[0046] Taking the above-mentioned ITO etching solutio...
Embodiment 3
[0055] The invention relates to an acetic acid-based ITO etching solution, which can be uniformly prepared from four raw materials: hydrochloric acid, acetic acid, potassium chloride and pure water.
[0056] Wherein, the percentage by weight of each raw material in the four kinds of raw materials can be respectively: hydrochloric acid 25%, acetic acid 9%, potassium chloride 0.5%, and the rest is pure water; when the purity of raw materials changes, its proportioning should be adjusted . The concentrations of the hydrochloric acid and the acetic acid can be respectively: 37% hydrochloric acid and 99.8% acetic acid; the purity of the potassium chloride can be 99%. The rest of the impurity components in the potassium chloride raw material are sodium chloride, water and a very small amount of impurities insoluble in the etching solution.
[0057] Wherein, in the acetic acid-based ITO etching solution, there are no more than 100 particles with a particle size greater than 0.3 μm p...
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