Nanometer-titania-based preparing method for etching liquid for circuit board

A technology of nano-titanium dioxide and etching solution, which is applied in the field of preparation of etching solution for circuit boards based on nano-titanium dioxide. controllability, surface tension reduction, and deterioration suppression effects

Inactive Publication Date: 2016-04-27
WUXI JIJIN ENVIRONMENTAL PROTECTION TECH CO LTD
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that the ammonia water in the microetching solution is volatile and has a pungent smell, so it is not conducive to operation, and the use time after configuration is short, only about 0.5 hours, which brings inconvenience to the metallographic section process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] The preparation method of above-mentioned circuit board etchant, comprises the steps:

[0016] Step 1: Add the weakly acidic cation exchange resin to 2.5% organic hydrochloric acid by weight, stir and mix, the stirring speed is 50 rpm, the stirring time is 5 minutes, the stirring temperature is 10°C, and then filter out the weak acid Cation exchange resin, control or remove impurity ions in organic hydrochloric acid;

[0017] The second step: put 2.5% by weight of nano-titanium dioxide and 1 / 3 of distilled water into the reactor, fully stir at normal temperature and pressure, the stirring time is 10 minutes, the stirring speed is 60 rpm, stirring The temperature is 12°C;

[0018] The third step: then add 0.5% ferric chloride by weight and stir for 6 minutes; add 0.5% nitric acid and stir for 5 minutes; add 1 / 3 of distilled water and stir for 4 minutes; add 2.5% by weight of organic hydrochloric acid, fully stirred for 5 minutes; adding 1.5% by weight of nonionic surfa...

Embodiment 2

[0025] The preparation method of above-mentioned circuit board etchant, comprises the steps:

[0026] Step 1: Add the weakly acidic cation exchange resin to 2.8% organic hydrochloric acid by weight, stir and mix, the stirring speed is 55 rpm, the stirring time is 6 minutes, and the stirring temperature is 12°C, then filter out the weak acid Cation exchange resin, control or remove impurity ions in organic hydrochloric acid;

[0027] The second step: put 3.5% by weight of nano-titanium dioxide and 1 / 3 of distilled water into the reaction kettle, fully stir at normal temperature and pressure, the stirring time is 11 minutes, and the stirring speed is 65 rpm. The temperature is 13°C;

[0028] Step 3: Then add 0.8% ferric chloride by weight and stir fully for 7 minutes; add 1.0% nitric acid by weight and fully stir for 6 minutes; add 1 / 3 of distilled water and fully stir for 5 minutes; add 2.8% by weight of organic hydrochloric acid, fully stirred for 6 minutes; add 1.9% by weig...

Embodiment 3

[0035] The preparation method of above-mentioned circuit board etchant, comprises the steps:

[0036] Step 1: Add the weakly acidic cation exchange resin to 2.8% organic hydrochloric acid by weight, stir and mix, the stirring speed is 60 rpm, the stirring time is 7 minutes, and the stirring temperature is 13°C, then filter out the weak acid Cation exchange resin, control or remove impurity ions in organic hydrochloric acid;

[0037] The second step: put 4.5% by weight of nano-titanium dioxide and 1 / 3 of distilled water into the reactor, fully stir at normal temperature and pressure, the stirring time is 12 minutes, the stirring speed is 70 rpm, stir The temperature is 14°C;

[0038] The third step: then add 1.2% iron trichloride by weight, fully stir for 7 minutes; add 1.6% nitric acid by weight, fully stir for 7 minutes; add 1 / 3 of distilled water, fully stir for 6 minutes; add 3.3% by weight of organic hydrochloric acid, fully stirred for 7 minutes; 2.3% by weight of nonio...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
Login to view more

Abstract

The invention discloses a nanometer-titania-based preparing method for etching liquid for a circuit board. The etching liquid includes, by weight percentage, 3.5%-6.5% of nanometer titania, 0.5%-1.2% of ferric trichloride, 0.5%-1.6% of nitric acid, 2.5%-3.3% of organic hydrochloric acid, 1.5%-2.3% of a non-ionic surface active agent, 0.5%-1.5% of a stabilizer, 3.5%-5.6% of a defoamer and the balance distilled water. According to the method, the nanometer titania is newly added on the basis of an original process, etching can be carried out under the condition that etch-resistant coating permeation does not occur, the etching speed of a chromium metal film is obviously increased, the controllability of the etching speed is achieved, degradation of the anti-corrosion protective layer is effectively restrained, chromium metal film wires with smooth surfaces are obtained, and the important application value is achieved.

Description

technical field [0001] The invention relates to a preparation method of an etching solution for a circuit board based on nano-titanium dioxide. Background technique [0002] At present, in the process of making circuit boards, the quality of circuit boards, the discovery and resolution of quality problems, and the evaluation of process improvement all need to be objectively inspected and judged by metallographic sections. The quality of the metallographic section directly affects the quality evaluation of the circuit board. The traditional metallographic slicing process includes sampling by milling; sealing the sample by resin mosaic method; grinding the sample; polishing the sample; microetching the sample. Wherein, the formula of the micro-etching liquid is 2-3 drops of hydrogen peroxide with a mass percentage of 50%, 8 ml of ammonia water with 25%-28%, and 8 ml of deionized water (DI water for short). Its disadvantage is that the ammonia water in the microetching soluti...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/26
CPCC23F1/26
Inventor 刘进军
Owner WUXI JIJIN ENVIRONMENTAL PROTECTION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap