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A kind of low-temperature sintering nano-silver paste and preparation method thereof

A nano-silver paste and low-temperature sintering technology, which is applied in cable/conductor manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., can solve the problem of high sintering temperature, and achieve lower sintering temperature, high thermal conductivity, and high reliability. Effect

Active Publication Date: 2011-12-21
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Silver paste is an interconnect thermal interface material with high thermal conductivity and high reliability. Due to the high sintering temperature of the existing silver paste, it cannot be applied to power chip interconnection in the field of electronic packaging.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0033] A kind of low temperature sintering nano-silver paste, its composition and weight percent are as follows:

[0034] 82.0% of nano-silver powder with an average particle size of 35nm;

[0035] Organic carrier polyvinyl alcohol 8.0%;

[0036] Organic solvent tributyl citrate 9.1%;

[0037] Surfactant Abietic Acid 0.9%.

[0038] The preparation method has the following steps successively:

[0039] 1) heating the water area of ​​the ethanol solution to 70° C., adding 9.1% by weight organic solvent tributyl citrate and 0.9% by weight surfactant abietic acid, and mechanically stirring and mixing;

[0040] 2) Add 8.0% by weight polyvinyl alcohol as the vehicle carrier under heating in a water bath at 80°C, and mechanically stir and mix evenly;

[0041] 3) After the mixture is cooled to 20°C, add nano-silver powder with a weight percentage of 82.0% and an average particle size of 35nm;

[0042] 4) Ultrasonic dispersion and mechanical agitation at zero degrees Celsius were p...

specific Embodiment approach 2

[0045] A kind of low temperature sintering nano-silver paste, its composition and weight percent are as follows:

[0046] 78.5% of nano-silver powder with an average particle size of 50nm;

[0047] Organic carrier polyvinyl alcohol 10.0%;

[0048] Organic solvent tributyl citrate 10.0%;

[0049] Surfactant Abietic Acid 1.5%. .

[0050] The preparation method is basically the same as the specific embodiment one, the difference is:

[0051] Step 1) heating the water area of ​​the ethanol solution to 80°C;

[0052] Step 4) Mechanically agitate the whole system for 1.5 hours.

specific Embodiment approach 3

[0053] A kind of low temperature sintering nano-silver paste, its composition and weight percent are as follows:

[0054] 89.5% of nano-silver powder with an average particle size of 20nm;

[0055] Organic carrier polyvinyl alcohol 4.5%;

[0056] Organic solvent tributyl citrate 5.5%;

[0057] Surfactant Abietic Acid 0.5%. .

[0058] The preparation method is basically the same as the specific embodiment one, the difference is:

[0059] Step 1) heating the water area of ​​the ethanol solution to 60°C;

[0060] Step 4) Mechanically agitate the whole system for 1.0 hour.

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Abstract

The invention discloses a low temperature-sintered nano silver paste and a preparation method thereof. The invention is characterized in that: by weight percent, the components of the nano silver paste are as follows: 78.5 to 89.5 percent of nano silver powder with the average grain size of 20nm to 50nm; 5.0 percent to 10.0 percent of polyvinyl alcohol as organic carrier; 5.0 percent to 10.0 percent of tributyl citrate as organic solvent; and 0.5 percent to 1.5 percent of abietic acid as surfactant. The nano silver paste preparation method sequentially includes the following steps: ethanol solution water heating, component adding and mixing, ultrasonic dispersion under zero DEG C, mechanical stirring and vacuum drying. The sintering temperature of the silver paste is notably decreased, and does not need to reach the softening temperature of glass, moreover, the silver content of the sintered material is at least 98 percent, the nano silver paste has high heat conductivity and high reliability, and the heat conductivity of the nano silver paste is three to four times higher than the heat conductivity of alloy solder, and thereby the heat-dissipating problem of packaging is effectively solved. The low temperature-sintered nano silver paste is particularly suitable for use as novel thermal interface material for the interconnection between power type chips in the field of electronic packaging.

Description

technical field [0001] The invention relates to silver paste, in particular to a low-temperature sintered nano silver paste. Background technique [0002] Thermal interface materials in the field of existing electronic packaging play a vital role in the heat dissipation of integrated chips and other components. Silver paste is an interconnect thermal interface material with high thermal conductivity and high reliability. Due to the high sintering temperature of the existing silver paste, it cannot be applied to power chip interconnection in the field of electronic packaging. Contents of the invention [0003] A technical problem to be solved by the present invention is to provide a low-temperature sintered nano-silver paste to make up for the above-mentioned defects in the prior art. [0004] Another technical problem to be solved by the present invention is to remedy the defects of the above-mentioned prior art and provide a method for preparing low-temperature sintered ...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00H01L23/373
CPCH01L24/29H01L2224/8384H01L2224/29339H01L2224/29294H01L2924/203H01L2924/0002
Inventor 王永吴晶唐欣李明雨王帅
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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