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Laser processing device of silicon glass bonding slice and method thereof

A laser processing and glass technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of easy pollution, easily damaged components, low processing efficiency, etc., to achieve easy popularization and application, small focusing spot, heat Small area of ​​influence

Active Publication Date: 2012-01-11
SUZHOU DELPHI LASER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to overcome the deficiencies in the prior art, and to provide a device and method for cutting silicon-glass bonded sheets by ultraviolet high-frequency ultrashort-pulse laser, aiming to overcome the low processing efficiency and easy production of For defects such as pollution and easily damaged devices, use ultraviolet high-frequency ultra-short pulse laser to cut silicon-glass bonding sheets

Method used

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  • Laser processing device of silicon glass bonding slice and method thereof
  • Laser processing device of silicon glass bonding slice and method thereof

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Embodiment Construction

[0014] The equipment and method for ultraviolet laser processing silicon-glass bonding sheet of the present invention adopts ultraviolet high-frequency ultrashort-pulse laser, and the processed materials are bonding materials such as silicon-glass, glass-silicon-glass, etc., and the laser is focused on the upper surface of the glass and As the cutting line deepens and correspondingly descends, the glass and silicon materials absorb the laser pulse and separate to achieve the effect of cutting.

[0015] Such as figure 1 As shown in the laser processing device for silicon-glass bonding sheets, the ultraviolet high-frequency ultrashort pulse laser is an ultraviolet or deep ultraviolet laser with a wavelength of less than 355nm, a laser with a pulse width of 10ps-100ns and a frequency of 10KHz-10MHz, The output end of the ultraviolet high-frequency ultrashort pulse laser 1 is arranged with an optical gate 2, and the output end of the optical gate 2 is provided with a beam expander...

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Abstract

The invention relates to a laser processing device of a silicon glass bonding slice and a method thereof. An output end of an ultraviolet high-frequency ultrashort pulse laser is provided with an optical gate, a beam expander and an aperture diaphragm, an output end of the aperture diaphragm is provided with a pair of 45-degree completely reflecting mirrors, output ends of the 45-degree completely reflecting mirrors are provided with deflection lenses, an output end of the deflection lens is provided with a 45-degree completely reflecting mirror, an output end of the 45-degree completely reflecting mirror is provided with a focus lens, the focus lens is right opposite to a three-dimensional movable platform, a CCD (Charge Coupled Device) illuminating lamp is arranged under the focus lens, and a coaxial CCD (charge coupled device) para-position observation system is distributed above the three-dimensional movable platform. Light beams sent by the ultraviolet high-frequency ultrashort pulse laser chemically focus a focal point on the upper surface of glass material, a spiral deflection lens controls the width of a once-cut cutting track, adjusts the cutting track into the cutting track with proper width, accurately positions the cut cutting track, and controls the focal point to correspondingly descend along with the increase of the cutting depth to orderly cut each cutting track on the silicon glass bonding slice.

Description

technical field [0001] The invention relates to equipment and a method for cutting a silicon-glass bonding sheet with an ultraviolet high-frequency ultrashort-pulse laser, and belongs to the technical field of laser micromachining. Background technique [0002] At present, the method of cutting silicon-glass bonding sheets is mainly diamond wheel cutting. Diamond cutting can cut materials such as glass and silicon. However, when using a diamond grinding wheel for processing, cutting fluid needs to be sprayed, which seriously pollutes the surface of high-purity silicon; the diamond grinding wheel is in direct contact with the bonding sheet, and the stress is likely to cause damage to the surrounding core electrical functional devices; the grinding wheel is also easy to block, requiring frequent It costs a lot to replace the grinding wheel and cutting fluid; the bonding chip breakage rate is high during cutting. [0003] Laser cutting technology is defined as a material proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/40B23K26/06B23K26/14B23K26/064
Inventor 赵裕兴狄建科益凯劼吴晓东
Owner SUZHOU DELPHI LASER
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