Laser processing device of silicon glass bonding slice and method thereof
A laser processing and glass technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of easy pollution, easily damaged components, low processing efficiency, etc., to achieve easy popularization and application, small focusing spot, heat Small area of influence
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[0014] The equipment and method for ultraviolet laser processing silicon-glass bonding sheet of the present invention adopts ultraviolet high-frequency ultrashort-pulse laser, and the processed materials are bonding materials such as silicon-glass, glass-silicon-glass, etc., and the laser is focused on the upper surface of the glass and As the cutting line deepens and correspondingly descends, the glass and silicon materials absorb the laser pulse and separate to achieve the effect of cutting.
[0015] Such as figure 1 As shown in the laser processing device for silicon-glass bonding sheets, the ultraviolet high-frequency ultrashort pulse laser is an ultraviolet or deep ultraviolet laser with a wavelength of less than 355nm, a laser with a pulse width of 10ps-100ns and a frequency of 10KHz-10MHz, The output end of the ultraviolet high-frequency ultrashort pulse laser 1 is arranged with an optical gate 2, and the output end of the optical gate 2 is provided with a beam expander...
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