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Copper-based bonding wire with anti-oxidation coating and processing technology thereof

A technology of anti-oxidation layer and bonding wire, applied in the field of bonding wire, can solve the problems of high price of bonding wire and high hardness of bonding copper wire, and achieve the effect of price advantage, convenient packaging and broad application prospect.

Active Publication Date: 2012-01-25
浙江佳博科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The present invention aims at the problems existing in the application of the above-mentioned traditional bonding wire, and provides a copper-based bonding wire, which solves problems such as high price of bonding gold wire, hardness of bonding copper wire, anti-oxidation, packaging, storage and transportation of bonding wire, etc.

Method used

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  • Copper-based bonding wire with anti-oxidation coating and processing technology thereof
  • Copper-based bonding wire with anti-oxidation coating and processing technology thereof

Examples

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Effect test

Embodiment 1

[0031] A copper-based bonding wire, the base material copper is added with La, Ce, Pt trace metal elements to form a master alloy substrate, and a gold layer is plated on the surface of the fine metal wire made of the master alloy substrate to form the copper-based bonding wire .

[0032] The purity of the copper in the bonding wire material and the gold plating layer are both higher than 99.99%.

[0033] The thickness of the gold plating on the surface of the copper-based bonding wire is 0.6 microns.

[0034] The mass proportion of each metal component in the copper-based bonding wire material is respectively: Cu is 94.9912%, trace metal element La is 0.0008%, Ce is 0.004%, Pt is 0.004%, and gold plating is 5%.

[0035] The preparation process of the copper-based bonding wire is as follows:

[0036] Step 1: smelt the master alloy blank, mix the metal substrate, mix the basic material Cu with the selected trace metal materials La, Pt, and Ce, melt the mixed metal material at...

Embodiment 2

[0045] A copper-based bonding wire, the base material copper is added with La, Ce, Pt trace metal elements to form a master alloy substrate, and a gold layer is plated on the surface of the fine metal wire made of the master alloy substrate to form the copper-based bonding wire .

[0046] The purity of the copper in the bonding wire material and the gold plating layer are both higher than 99.99%.

[0047] The thickness of the gold plating on the surface of the copper-based bonding wire is 0.25 microns.

[0048] The mass proportion of each metal component in the copper-based bonding wire material is respectively: Cu is 96.98%, trace metal element La is 0.010%, Ce is 0.005%, Pt is 0.005%, and gold plating is 3%.

[0049] The preparation process of copper-based bonding wire is as follows:

[0050] Step 1: smelt the master alloy blank, mix the metal substrate, mix the basic material Cu with the selected trace metal materials La, Pt, and Ce, melt the mixed metal material at a hig...

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Abstract

The invention provides a processing technology of an anti-oxidation coating of a copper-based bonding wire, which is characterized in that trace metal elements such as La (lanthanum), Ce (cerium) and Pt (platinum) are added to a copper base material to obtain a master alloy base material, and a gold layer is plated on a fine metal wire surface made of the master alloy base material so as to obtain the copper-based bonding wire, wherein the purities of the copper and the gold are over 99.99%. The invention also provides a manufacturing process of the copper-based bonding wire, comprising the following steps of: mixed smelting, drawing, washing, gold-plating, annealing, winding, packaging and the like. The copper-based bonding wire integrates the advantages of a copper bonding wire and a gold bonding wire, and has the characteristics of good resistance to oxidation and conductivity, low radian and price, improved hardness of a single copper material and the like. The copper-based bonding wire is packaged commonly, can be preserved for a long time at normal temperature, and is a substitute for an expensive gold bonding wire.

Description

technical field [0001] The invention relates to bonding wire technology, in particular to a master alloy copper-based bonding wire and its preparation technology. Background technique [0002] Semiconductor packaging in integrated circuits requires the use of a key material - Bonding Wires. The rapid development of the electronics industry has promoted the rapid development of bonding wire manufacturing technology. Bonding wire is a fine-diameter high-tensile-strength metal wire, which is an essential package inner lead in the manufacturing process of integrated circuits, semiconductor discrete devices and LED light-emitting tubes. The common ones are alloy bonding wire, copper bonding wire, aluminum bonding wire, gold bonding wire, etc. The characteristics required for bonding wires are corrosion resistance, conductivity, good connectivity, and fast bonding speed. [0003] In the existing bonding wire application technology, the more representative bonding wires are bondi...

Claims

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Application Information

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IPC IPC(8): H01L23/49H01B1/02H01B5/02H01B13/00C22B9/00C22B1/02B21C1/00C25D3/48C25D7/06C22F1/08
CPCH01L24/43H01L2224/45644H01L2224/45144H01L2224/43H01L2924/00014H01L2924/01006H01L2224/45147H01L24/45H01L2224/45565H01L2224/43848H01L2224/45H01L2224/45015H01L2924/00011H01L2924/14H01L2924/01204H01L2924/01057H01L2924/01058H01L2924/01046H01L2924/01078H01L2924/00015H01L2924/013H01L2924/00H01L2224/48H01L2924/2011H01L2924/00012H01L2924/20751H01L2924/20752H01L2924/20753H01L2924/20754H01L2924/20755H01L2924/20756H01L2924/20757
Inventor 薛子夜周钢赵碎孟
Owner 浙江佳博科技股份有限公司
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