Preparation method for multilayer copper/molybdenum structure composite plate

A composite plate and copper plate technology, applied in the direction of metal rolling, can solve the problems of low tensile strength, poor interface bonding, low yield strength, etc., and achieve the effect of increasing bonding strength, high yield, and improving electrical conductivity

Inactive Publication Date: 2012-02-22
XI'AN UNIVERSITY OF ARCHITECTURE AND TECHNOLOGY
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  • Abstract
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Problems solved by technology

At the same time, in order to solve the problems of low tensile strength, low yield strength and low elongation of the existing copper / molybdenum / copper composite board, especially the problem of poor interface bonding, a method for preparing a copper / molybdenum multilayer structure composite board is provided and Its surface treatment method and heat treatment system are a new type of multifunctional structural material developed for the market.

Method used

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  • Preparation method for multilayer copper/molybdenum structure composite plate
  • Preparation method for multilayer copper/molybdenum structure composite plate
  • Preparation method for multilayer copper/molybdenum structure composite plate

Examples

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Embodiment 1

[0027] Embodiment 1: the preparation of five-layer copper / molybdenum composite board

[0028] see figure 1 As shown in Figure 3(a), this example presents a method for preparing a five-layer copper / molybdenum composite board. The structure of the fabricated copper / molybdenum five-layer composite board is copper / molybdenum / copper / molybdenum / copper, specifically Follow these steps to implement:

[0029] 1. Preparation of molybdenum plate and copper plate

[0030] Use industrial pure molybdenum blanks at 1000°C to 1350°C to roll them into molybdenum plates with a thickness of 0.5mm to 6mm, and treat them for 1.5 hours according to the conventional heat treatment process conditions, and then cool with the furnace;

[0031] Take the industrial pure copper plate, the thickness of the copper plate is: 1.0 ~ 10.0mm, put it in the annealing furnace, anneal at 600 ℃ for 1h ~ 1.5h, and cool with the furnace;

[0032] Grinding the surface of the above-mentioned molybdenum plate and copp...

Embodiment 2

[0039]Embodiment 2: the preparation of nine-layer copper / molybdenum composite board

[0040] Prepare according to the five-layer copper / molybdenum / copper / molybdenum / copper multilayer structure composite board prepared in Example 1, repeat the operation from the grinding operation in Step 1 to Step 6 in Example 1, and carry out the accumulation of 3 to 6 passes Composite rolling, and the heat treatment of step 7 is carried out to obtain a composite plate with nine layers of copper / molybdenum / copper / molybdenum / copper / molybdenum / copper / molybdenum / copper structure (the thickness ratio of copper plate and molybdenum plate is 1:1:2: 1:2:1:2:1:1), as shown in Figure 3(b).

[0041] After testing, the tensile strength of the copper / molybdenum composite board prepared in the above embodiment is 390-620 MPa, the yield strength is 200-300 MPa, and the elongation is 25%-30%. Subsequent selective rolling or shearing can be done according to the required size.

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Abstract

The invention discloses a preparation method for a multilayer copper/molybdenum structure composite plate. The multilayer copper/molybdenum structure composite plate prepared by the method has the structure that a layer of molybdenum plate is arranged between two layers of copper plates, and the sum of the copper plate layers and the molybdenum plate layers is five at least. The preparation method comprises the steps of surface treatment, lamination, single-pass hot-rolling compounding, intermediate annealing, accumulative rolling of a multilayer composite plate, finished product annealing and following processing. The copper/molybdenum multilayer material prepared by the method has no interface cracking phenomenon in the rolling process, and the interface has no oxidation phenomenon in the heat treatment process under the condition of argon/hydrogen protection; and the prepared composite plate has the tensile strength of 390-620MPa, the yield strength of 200-300MPa and the elongation of 25-30 percent. The method has the characteristics of simple manufacture process, strong controllability and high yield and the biggest advantage of being available for mass production.

Description

technical field [0001] The present invention relates to the preparation of composite materials, especially a method for preparing a multilayer copper / molybdenum multilayer structure composite board. The layer structure of the multilayer composite board prepared by the method is copper / molybdenum / copper / molybdenum / ... / copper . Background technique [0002] Copper / molybdenum multilayer composite boards are generally used in electronic packaging materials. At present, there are two main methods of manufacturing copper / molybdenum composite plates, liquid-solid combined rolling method and solid-solid rolling method. The main composite mechanism of solid-solid rolling is to remove surface pollution by surface treatment of the plate. Layer, to obtain a clean surface, and at the same time make the surface have a certain roughness, the surface of the sheet with a certain roughness meshes with each other during rolling, forming a preliminary mechanical bond, and at the same time, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21B1/38
Inventor 王快社张兵王峰王文
Owner XI'AN UNIVERSITY OF ARCHITECTURE AND TECHNOLOGY
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