Method for modifying surface of nano-porous copper by adopting chemical nickel-plating method
A nanoporous copper and electroless nickel plating technology, which is applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of poor corrosion resistance of nanoporous copper, and achieve improved corrosion resistance and simple process Effect
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Embodiment 1
[0028] A mixed solution of 0.25 mol / L lactic acid and 0.1 mol / L citric acid was prepared with distilled water at room temperature, stirred thoroughly until completely dissolved, and then left to stand. Take another distilled water with the volume of the mixed solution, and add 2.5mmol / L NiSO 4 ·6H 2 O, stir well until completely dissolved and then stand still. The obtained two solutions were mixed, added a magnetic stirring bar, placed in a constant temperature heating magnetic stirrer at room temperature and stirred until the solution was evenly mixed, and then 10% NaOH was added dropwise until the pH of the solution was 5. Follow with NiSO 4 ·6H 2 The molar concentration ratio of O is 3:1, and the sodium hypophosphite is weighed, fully stirred until completely dissolved, and left standing. Then, according to the volume ratio of the pattern to the plating solution 1:500, the nanoporous copper with a thickness of 2 mm after pretreatment and drying with distilled water was ...
Embodiment 2
[0030] At room temperature, prepare a mixed solution of 0.1 mol / L lactic acid and 0.1 mol / L citric acid with distilled water, stir well until completely dissolved, and then let stand. Take another distilled water with the volume of the mixed solution, and add 3.5mmol / L NiSO 4 ·6H 2 O, stir well until completely dissolved and then stand still. The obtained two solutions were mixed, added a magnetic stirring bar, placed in a constant temperature heating magnetic stirrer at room temperature and stirred until the solution was evenly mixed, and then 10% NaOH was added dropwise until the pH of the solution was 5. Follow with NiSO 4 ·6H 2 The molar concentration ratio of O is 3:1, and the sodium hypophosphite is weighed, fully stirred until completely dissolved, and left standing. Then according to the volume ratio of the pattern to the plating solution 1:500, the nanoporous copper with a thickness of 2 mm after pretreatment and drying with distilled water was placed in the above...
Embodiment 3
[0032] A mixed solution of 0.5 mol / L lactic acid and 0.1 mol / L citric acid was prepared with distilled water at room temperature, stirred thoroughly until completely dissolved, and then left to stand. Take another distilled water with the volume of the mixed solution, and add 5mmol / L NiSO 4 ·6H 2 O, stir well until completely dissolved and then stand still. The obtained two solutions were mixed, added a magnetic stirring bar, placed in a constant temperature heating magnetic stirrer at room temperature and stirred until the solution was evenly mixed, and then 10% NaOH was added dropwise until the pH of the solution was 5. Follow with NiSO 4 ·6H 2 The molar concentration ratio of O is 3:1, and the sodium hypophosphite is weighed, fully stirred until completely dissolved, and left standing. Then according to the volume ratio of the pattern and the plating solution 1:500, the nanoporous copper with a thickness of 2 mm after pretreatment and drying with distilled water is plac...
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