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Method for modifying surface of nano-porous copper by adopting chemical nickel-plating method

A nanoporous copper and electroless nickel plating technology, which is applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of poor corrosion resistance of nanoporous copper, and achieve improved corrosion resistance and simple process Effect

Inactive Publication Date: 2013-12-04
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for modifying the surface of nanoporous copper by electroless nickel plating, which solves the problem of poor corrosion resistance of nanoporous copper

Method used

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  • Method for modifying surface of nano-porous copper by adopting chemical nickel-plating method
  • Method for modifying surface of nano-porous copper by adopting chemical nickel-plating method
  • Method for modifying surface of nano-porous copper by adopting chemical nickel-plating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A mixed solution of 0.25 mol / L lactic acid and 0.1 mol / L citric acid was prepared with distilled water at room temperature, stirred thoroughly until completely dissolved, and then left to stand. Take another distilled water with the volume of the mixed solution, and add 2.5mmol / L NiSO 4 ·6H 2 O, stir well until completely dissolved and then stand still. The obtained two solutions were mixed, added a magnetic stirring bar, placed in a constant temperature heating magnetic stirrer at room temperature and stirred until the solution was evenly mixed, and then 10% NaOH was added dropwise until the pH of the solution was 5. Follow with NiSO 4 ·6H 2 The molar concentration ratio of O is 3:1, and the sodium hypophosphite is weighed, fully stirred until completely dissolved, and left standing. Then, according to the volume ratio of the pattern to the plating solution 1:500, the nanoporous copper with a thickness of 2 mm after pretreatment and drying with distilled water was ...

Embodiment 2

[0030] At room temperature, prepare a mixed solution of 0.1 mol / L lactic acid and 0.1 mol / L citric acid with distilled water, stir well until completely dissolved, and then let stand. Take another distilled water with the volume of the mixed solution, and add 3.5mmol / L NiSO 4 ·6H 2 O, stir well until completely dissolved and then stand still. The obtained two solutions were mixed, added a magnetic stirring bar, placed in a constant temperature heating magnetic stirrer at room temperature and stirred until the solution was evenly mixed, and then 10% NaOH was added dropwise until the pH of the solution was 5. Follow with NiSO 4 ·6H 2 The molar concentration ratio of O is 3:1, and the sodium hypophosphite is weighed, fully stirred until completely dissolved, and left standing. Then according to the volume ratio of the pattern to the plating solution 1:500, the nanoporous copper with a thickness of 2 mm after pretreatment and drying with distilled water was placed in the above...

Embodiment 3

[0032] A mixed solution of 0.5 mol / L lactic acid and 0.1 mol / L citric acid was prepared with distilled water at room temperature, stirred thoroughly until completely dissolved, and then left to stand. Take another distilled water with the volume of the mixed solution, and add 5mmol / L NiSO 4 ·6H 2 O, stir well until completely dissolved and then stand still. The obtained two solutions were mixed, added a magnetic stirring bar, placed in a constant temperature heating magnetic stirrer at room temperature and stirred until the solution was evenly mixed, and then 10% NaOH was added dropwise until the pH of the solution was 5. Follow with NiSO 4 ·6H 2 The molar concentration ratio of O is 3:1, and the sodium hypophosphite is weighed, fully stirred until completely dissolved, and left standing. Then according to the volume ratio of the pattern and the plating solution 1:500, the nanoporous copper with a thickness of 2 mm after pretreatment and drying with distilled water is plac...

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Abstract

The invention discloses a method for modifying the surface of nano-porous copper by adopting a chemical nickel-plating method, comprising the following steps: firstly, preparing a mixed solution of lactic acid and citric acid at a room temperature, adding and dissolving NiSO4.6H2O into distilled water with the volume equal to that of the mixed solution, mixing the two solutions, stirring the solutions to be uniform and then adding a NaOH solution dropwise until the PH value of the mixed solution is 5-11, thus obtaining a NiSO4.6H2O solution; mixing a hypophosphorous acid solution with the NiSO4.6H2O solution, thus obtaining a plating solution; conducting pretreatment and drying on the nano-porous copper with the distilled water, then placing the nano-porous copper in the plating solution for plating, and then taking out the nano-porous copper to be washed and cleaned after the plating is completed, thus obtaining the modified nano-porous copper uniformly plated with nickel; and finally conducting sample sealing treatment on the modified nano-porous copper by adopting paraffin. The method is simple and convenient in process, and the common chemical nickel-plating method is adopted to modify the nano-porous copper, thus obtaining core-shell composite material with the pore wall uniformly plated; and the corrosion resistance of the core-shell composite material in an alkaline environment is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of preparation of nanoporous metal materials, and relates to a method for modifying the surface of nanoporous copper by using an electroless nickel plating method. Background technique [0002] Nanoporous metal materials not only have high specific surface area, specific modulus and other characteristics, but also have excellent properties such as high thermal conductivity and high electrical conductivity of metal materials, so they have broad applications in the fields of catalysis, noise reduction and vibration absorption, shielding, heat exchange, etc. application prospects. The current research applications are mainly the preparation of micro-nano-scale strip-type nanoporous gold and silver, and the modification of catalytic performance by loading noble metal platinum on it. [0003] For industrial applications, the production cost of porous noble metals is high, and the practical application is limited...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/36
Inventor 梁淑华王嘉邹军涛
Owner XIAN UNIV OF TECH