Electroplating production method and device for copper/aluminum composite conducting bar

Abstract

The invention relates to a conducting bar for power transmission, in particular to an electroplating production method and a device for a copper/aluminum composite conducting bar under the action of ultrasound and an electric magnetic field. The electroplating production method and the device are characterized in that the less change for a traditional process of a copper/aluminum composite conducting bar is carried out; no special requirements for a substrate material and the state of the substrate material are needed; in the traditional method for producing the copper/aluminum composite conducting bar: firstly, ultrasonic wave cleaning is applied in the cleaning process, so that the aluminum bar can be better cleaned; and secondly, the electric magnetic filed is applied in the main plating process for carrying out electromagnetic stirring on an electroplating liquid and improving the distribution of electroplating ions in the electroplating liquid; the electromagnetic stirring realizes non-contact stirring, so that the pollution to the electroplating liquid is avoided; and in addition, the stirring strength is easily and accurately controlled and the goals of low production cost and uniform and compact coating of the copper/aluminum composite conducting bar are achieved.

Description

technical field [0001] The invention relates to a conductive bar for power transmission, in particular to an electroplating preparation method and device for a copper / aluminum composite conductive bar under the action of ultrasonic waves and electromagnetic fields. Background technique [0002] With the rapid development of my country's electric power industry, the demand for power transmission equipment (such as high and low voltage switchgear, high and low voltage busway, etc.) Relatively scarce, 40%~50% of its copper materials are dependent on imports, resulting in rising copper prices in recent years and increasing the manufacturing cost of enterprises. In order to reduce costs, copper substitute products have gradually appeared in the market. For example, using the characteristics of my country's rich aluminum resources, copper / aluminum composite conductive bars are prepared, and a small amount of copper is combined with other metals to make products to replace copper. ...

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Problems solved by technology

[0003]Currently, the common preparation method of copper / aluminum composite conductive bars on the market is the cladding method. By concentrically cladding high-purity copper strips on the outer surface of aluminum conductors, Through multi-pass drawing and heat treatment, the required conductive products are made. Compared with pure copper conductors, copper / aluminum composite conductors have obvious advantages: light weight, soft wire quality, low cost, saving copper resources, etc., but The following defects exist in the preparation of copper / aluminum composite conductive bars by the cladding method: 1. The copper content in the conductor is still relatively large, and its copper content is about 40% by weight, and the material cost is relatively high; 2. The combination of the two metals Insufficient fastness, some finished products can see gaps from the section after production, which affects the quality and conductivity of the conductor

[0004] Chinese patent 200910035288.5 proposes an electroplating preparation method for a copper / aluminum composite conductive row, by adopting the method of electroplating copper on the surface of the aluminum row to prepare a copper-containing and relatively small weight Combining the two metals with denser conductive row products, this preparation method has obvious advantages in quality and cost compared with the coating method, but there are still problems when the electroplating production method proposed in this patent is directly used in the production of copper / aluminum composite conductive row. Some shortcomings: It is difficult to completely clean the surface of the aluminum row by chemical cleaning alone; in order to make the electrolytic copper plated on the product surface evenly distributed, the copper sulfate solution on the product surface is stirred by blowing gas during electroplating, but the gas stirring method The stirring intensity is limited, the stirring is uneven, and the gas injection will bring impurities into the electroplating tank, contaminate the solution, and make the plating solution contact with air, which is easy to oxidize the solution, which is not conducive to improving product quality.

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