Adhesive composition, connection structure, connection structure manufacturing method and application of adhesive composition
A composition and adhesive technology, applied in the field of adhesive compositions, can solve the problems of large curing shrinkage and poor bonding strength, etc.
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no. 1 Embodiment approach
[0057]The adhesive composition according to the first embodiment of the present invention is characterized by being used for connecting a first circuit member having a first connection terminal on the main surface and a second circuit member having a second connection terminal on the main surface. An adhesive composition comprising (a) a thermoplastic resin, (b) a radical polymerizable compound, (c) a radical polymerization initiator, and (d) a vinyl compound having a phosphoric acid group, ( b) The radically polymerizable compound includes a urethane (meth)acrylate having a critical surface tension of 20 to 40 mN / m.
[0058] Hereinafter, each component will be described in detail. The (a) thermoplastic resin used in the present embodiment refers to a resin (polymer) having a property of being changed into a liquid state with a high viscosity by heating, freely deforming by an external force, and remaining in its state when cooled and the external force is removed. The shape ...
no. 2 Embodiment approach
[0142] Furthermore, the adhesive composition according to the second embodiment of the present invention is characterized in that it is used for connecting a first circuit member having a first connection terminal on the main surface and a second circuit member having a second connection terminal on the main surface. Adhesive composition for circuit components, comprising (a) thermoplastic resin, (b) radically polymerizable compound and (c) radically polymerizable initiator, (b) radically polymerizable compound containing urethane (meth)acrylate , the elongation at break is 300 to 500%.
[0143] By making the adhesive composition according to the above-mentioned second embodiment contain the above components, (b) the radically polymerizable compound contains urethane (meth)acrylate, and the elongation at break is 300 to 500%, adhesion can be imparted Since the agent composition has sufficient flexibility to follow the deformation of the adherend (polyimide, PET, PC, PEN, etc.)...
Embodiment 1～12 and comparative example 1～5
[0197] The thermoplastic resin, the radically polymerizable compound, and the radical polymerization initiator were blended at the solid mass ratio shown in Table 2, and then the conductive particles were blended and dispersed at 1.5% by volume to obtain an adhesive composition. The obtained adhesive composition was coated on a fluororesin film with a thickness of 80 μm using a coating apparatus, and was dried with hot air at 70° C. for 10 minutes to obtain a film-like adhesive composition with a thickness of the adhesive layer of 20 μm. .
[0198] [Table 2]
[0199]
[0200] [Measurement of elongation at break, storage modulus, connection resistance, and adhesive strength]
[0201]The film adhesive compositions of Examples 1 to 12 and Comparative Examples 1 to 5 were interposed on a flexible wiring board ( FPC) and glass (thickness 1.1 mm, surface resistance 20Ω / □) formed with ITO thin layer of 0.2 μm. This was heated and pressurized under the conditions of 160° C. and ...
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Abstract
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