Protective film and method for producing same
A technology of protective film and deposited film, which is applied in the direction of transportation and packaging, vacuum evaporation plating, coating, etc., can solve the problem of hard film peeling, and achieve the effect of easy formation
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Embodiment 1
[0091] A six-axis robot is used to draw grid-like lines on the surface of a sample (tube) having a curved surface. The material of the base material of the sample is stainless steel. As the drawing material, Ketjen Black was dispersed in a polymer. Using the teaching function (the function of placing the front end of the robot on the actual object (processed object) and reading the coordinates from the actual object (processed object)), complete the program through arc completion, parabola completion, and free curve Completion is used to continuously form a trajectory on a curved surface, and it is drawn so that the tip of the robot arm is always perpendicular to the surface. The drawing speed is 30mm / s. After drying the drawing material, a DLC film is formed by a pulse plasma CVD method. Film-forming conditions were as follows.
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[0093] After film formation, the polymer base material of the drawing part is dissolved with acetone or alcohol to realize a DLC fil...
Embodiment 2
[0095] Coat the resist on the substrate and form it into a thickness of about 50 μm by ultrasonic or spin coating machine. From the front end of the six-axis robot, the pulsed Q-switched YAG laser (1.06 μm) is concentrated at the front end through the optical fiber to 30 μm to the substrate. The material is irradiated to cure the resist in the irradiated part. A linear pattern was formed by scanning the laser at intervals of 200 to 300 μm. Similar to Example 1, position control is performed by the robot so that the laser light is always irradiated from an equidistance with respect to the curved surface. Furthermore, by scanning in the same manner in the straight direction, a checkerboard hole structure was produced. Then, the non-irradiated portion was removed with a remover, and then a DLC film was formed by high-frequency plasma CVD under the conditions shown below. Then, the resist was lifted off (lifted off) to obtain a segment-structure DLC film.
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Embodiment 3
[0098] In the same manner as in Example 1, a 20 μm wide microtome for Si wafer slicing was introduced into a groove with a vertical and horizontal depth of 20 μm while controlling the position by a robot, and after ultrasonic cleaning was performed with acetone, a DLC film was formed under the following conditions. A DLC film with a segmented structure was obtained.
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