Flux paste for high-bismuth content solder paste and preparation method thereof

A technology of solder paste and solder paste, which is applied in the direction of welding equipment, welding medium, manufacturing tools, etc., can solve the unsolved problems of high bismuth-containing solder paste, black substances, etc., and achieve the effect of improving yield and good benefit

Inactive Publication Date: 2012-06-27
厦门市及时雨焊料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese patent CN1123210A discloses three surface treatment methods of tin powder to improve the stability of solder paste, which does not involve solder paste
None of the above patents solves the technical problem of black substance produced by high bismuth-containing solder paste

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Add hydrogenated rosin, polymerized rosin, diethylene glycol monohexyl ether, xylene, and hydrogenated castor oil into the beaker in proportion according to the weight percentages in Table 1, heat until clarified, then slowly stir and cool. Weigh in hydroxyethylethylenediaminetriacetic acid triethanolamine salt, ascorbic acid, and 1,2,3-benzotriazole, and grind it with a three-roll mill, and use a scraper fineness agent to detect it. The paste fineness is less than 10μm can get solder paste.

Embodiment 2

[0028] Add hydrogenated rosin, polymerized rosin, diethylene glycol monohexyl ether, xylene, and hydrogenated castor oil into the beaker in proportion according to the weight percentages in Table 1, heat until clarified, then slowly stir and cool. Add triethanolamine cyclohexanediaminetetraacetic acid, ascorbic acid, and 1,2,3-benzotriazole, and grind with a three-roll mill, and detect with a scraper fineness agent, and the paste fineness is less than 10 μm. Solder paste available.

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PUM

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Abstract

The invention belongs to the field of welding materials for an electronic industry, and provides flux paste for high-bismuth content solder paste and a preparation method thereof. The flux paste for the high-bismuth content solder paste comprises the following components in percentage by weight: 20 to 60 percent of resin, 20 to 50 percent of solvent, 2 to 8 percent of thixotropic agent, 2 to 10 percent of activating agent, 0.05 to 10 percent of corrosion inhibitor and 0.05 to 10 percent of antioxidant. According to the flux paste, by optimizing and selecting the activating agent in the flux paste, the high-bismuth content solder paste prepared from the flux paste does not generate black residues in the using process, and excellent performance such as the storage stability, wettability, impressionability and the like of the high-bismuth content solder paste is kept simultaneously, so that the problems in the prior art are solved effectively, the yield of products is improved, and the good benefit is obtained.

Description

technical field [0001] The invention belongs to the field of soldering materials used in the electronics industry, and in particular relates to a soldering flux used for solder paste with high bismuth content and a preparation method thereof. Background technique [0002] Solder paste (solder paste, also known as solder paste) is a solder material used in reflow soldering of electronic printed circuit boards. It is made by mixing and stirring solder powder and solder paste. Solder powder, also known as tin powder, is mainly composed of tin. According to needs, a certain amount of silver, bismuth and other metals can be added to tin, and its particle size is usually 20-75 μm. Soldering paste is a paste-like soldering composition, usually containing resins, thixotropic agents, solvents, activators, corrosion inhibitors and other additives. The solder paste has two functions in the solder paste: one is to help soldering, that is, to remove metal oxides when heated, so an activ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
Inventor 孙洪日罗礼伟郑序漳
Owner 厦门市及时雨焊料有限公司
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