A heat treatment method for a passivation layer of a heterogeneous crystalline silicon solar cell
A heat treatment method and solar cell technology, applied in the direction of circuits, electrical components, sustainable manufacturing/processing, etc., can solve the problems of unfavorable industrial production and long time, so as to improve the passivation effect, increase production efficiency, and improve conversion efficiency. Effect
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Embodiment 1
[0014] A layer of 25nm a-Si:H was prepared as a passivation layer on both sides of the cleaned N-type silicon by PECVD method, and the minority carrier lifetime after passivation was 320μs.
[0015] The high-energy active hydrogen plasma generated by the PECVD method is used to heat-treat the silicon wafer deposited with the passivation layer. The specific process parameters are as follows: a 13.56MHz radio frequency source is used to excite the plasma, and the radio frequency power density added to the plate is 0.08W / cm 2 , the air pressure is 25Pa, and the silicon wafer is heated to 280°C for 30 minutes.
[0016] After heat treatment, the minority carrier lifetime reaches 600μs, and the thickness of the passivation layer is reduced to 15nm. If conventional heat treatment is adopted, the heat treatment time needs to be about 120 minutes.
Embodiment 2
[0018] A layer of 20nm a-Si:H was prepared as a passivation layer on both sides of the cleaned N-type silicon by hot wire CVD method, and the minority carrier lifetime after passivation was 350μs.
[0019] The high-energy active hydrogen atom atmosphere generated by the hot wire CVD method is used to heat-treat the silicon wafer deposited with the passivation layer. The specific process parameters are as follows: Tungsten wire is used as the hot wire, the temperature of the hot wire is heated to 1800°C, the air pressure is 10Pa, and the silicon wafer is heated. to 220°C for 25 minutes.
[0020] After heat treatment, the minority carrier lifetime reaches 680μs, and the thickness of the passivation layer is reduced to 12nm. If conventional heat treatment is adopted, the heat treatment time needs to be about 120 minutes.
Embodiment 3
[0022] A layer of 25nm a-Si:H was prepared as a passivation layer on both sides of the cleaned N-type silicon by PECVD method, and the minority carrier lifetime after passivation was 320μs.
[0023] The high-energy active hydrogen plasma generated by the PECVD method is used to heat-treat the silicon wafer deposited with the passivation layer. The specific process parameters are as follows: a 13.56MHz radio frequency source is used to excite the plasma, and the radio frequency power density added to the plate is 0.8W / cm 2 , the air pressure is 75Pa, and the silicon wafer is heated to 260°C for 40min.
[0024] After heat treatment, the minority carrier lifetime reaches 580μs, and the thickness of the passivation layer is reduced to 14nm. If conventional heat treatment is adopted, the heat treatment time needs to be about 120 minutes.
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