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Fixed abrasive grain wire, process for producing the fixed abrasive grain wire, and abrasive grains for use in fixed abrasive grain wire

A technology for fixing abrasive grains and abrasive grains, which is applied in the direction of manufacturing tools, grinders, abrasives, etc., can solve the problems of abrasive grain shedding and insufficient fixation force, and achieve the effect of not easy to fall off and good cutting ability

Inactive Publication Date: 2012-07-11
JAPAN FINE STEEL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the method of attaching abrasive grains to the wire with resin does not have sufficient fixing force, the abrasive grains may be damaged due to the frictional action of dicing in the process of cutting the workpiece into wafers by the intense reciprocating motion of the wire. fall off

Method used

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  • Fixed abrasive grain wire, process for producing the fixed abrasive grain wire, and abrasive grains for use in fixed abrasive grain wire
  • Fixed abrasive grain wire, process for producing the fixed abrasive grain wire, and abrasive grains for use in fixed abrasive grain wire
  • Fixed abrasive grain wire, process for producing the fixed abrasive grain wire, and abrasive grains for use in fixed abrasive grain wire

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Embodiment

[0124] The following describes the embodiments of the present invention, but the present invention is not limited to the following embodiments, and appropriate changes and modifications can be made without departing from the technical scope of the present invention;

[0125] (1) Manufacture fixed abrasive wire by electroplating

[0126] through as Figure 4 The plating apparatus of the schematic structure shown can manufacture fixed abrasive wires. That is, the steel wire 22 is conveyed from the wire feeder 21, and the steel wire 22 is alkaline degreased in an alkaline degreasing tank (pH is an alkaline degreasing agent of 11) 23, and the steel wire 22 is alkaline degreased in a pickling tank (pH is a sulfuric acid of 1) 24 Medium pickling, washing in water washing tank 25, pretreatment in pretreatment tank (bath composition of nickel sulfamate 4 hydrate 600g / liter, pH 4.2) 26, and in plating tank 27 to steel wire The surface of 22 is nickel-plated, afterward, after the stee...

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Abstract

Disclosed is a process that can stably produce a fixed abrasive grain wire provided with a covering of a metal plating layer with a plurality of abrasive grains incorporated therein. A metallic wire is immersed in an electrolysis solution containing a plurality of abrasive grains and cations of a metal to be plated. A suitable potential difference is provided between an anode and a cathode which is the metallic wire, whereby the plurality of abrasive grains contained in the electrolysis solution and a metal produced from the cations by a reduction are deposited on the surface of the metallic wire as the cathode to produce a fixed abrasive grain wire provided with a covering of a metal plating layer containing a plurality of abrasive grains. The abrasive grains contained in the electrolysis solution have a surface that has been previously plated with a metal having a lower ionization tendency than silver.

Description

technical field [0001] The present invention relates to a fixed abrasive wire, a method for producing the same, and abrasive grains used for the fixed abrasive wire. Background technique [0002] The fixed abrasive wire is a tool for fixing abrasive grains on the wire, especially for cutting, slicing, internal surface grinding, dicing, and ingot cutting of hard materials such as silicon, quartz, and ceramics. [0003] In order to facilitate understanding of the present invention, an example of use of the fixed abrasive wire will be described below. For example, the fixed abrasive wire can be used in a wire saw. In this wire saw, a thin line of tension is moved, and while a slurry-like abrasive material containing abrasive grains is blown to the line, the workpiece (such as a silicon crystal ingot) is pressed to the line, and the free abrasive grains A device that cuts the workpiece into wafers by grinding is called a multi-wafer dicing method because multiple wafers can be ...

Claims

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Application Information

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IPC IPC(8): B24D3/00B24B27/06B24D11/00
CPCB24B27/0633B24D18/0018B24B27/06B24D3/00B24D11/00
Inventor 尾崎则行土桥一公
Owner JAPAN FINE STEEL