Method of fabricating array substrate for liquid crystal display

Abstract

Disclosed is a method of fabricating an array substrate for a liquid crystal display, including forming a copper-based metal layer on a substrate and etching the copper-based metal layer using an etchant composition thus forming gate wiring, and forming a copper-based metal layer on a semiconductor layer and etching the copper-based metal layer using the etchant composition thus forming source/drain electrodes, the etchant composition including based on the total weight of the composition, A) 5.0 ~ 25 wt% of hydrogen peroxide (H2O2), B) 0.01 ~ 1.0 wt% of a fluorine-containing compound, C) 0.1 ~ 5.0 wt% of an azole compound, D) 0.1 ~ 10.0 wt% of one or more compounds selected from among phosphonic acid derivatives and salts thereof, and E) a remainder of water.

Description

technical field [0001] The invention relates to a method for manufacturing an array substrate for a liquid crystal display, an etchant composition for a copper-based metal layer, and a method for etching a copper-based metal layer using the etchant composition. Background technique [0002] In general, forming metal wiring on a substrate of a semiconductor device includes forming a metal layer by sputtering, coating a photoresist, performing exposure and development so that the photoresist is formed on a selected area, and performing etching, and A cleaning process is performed before or after each individual process. During the etching process, the metal layer is formed on selected areas using the photoresist as a mask. The etching process generally includes dry etching using plasma or wet etching using an etchant composition. [0003] Recently, in such semiconductor devices, the resistance of metal wiring is considered to be very important. This is because resistance is...

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Problems solved by technology

However, because the performance of the etchant compositions known so far for copper-based metal lay

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