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Compound gallium nitride based semiconductor growing substrate and producing method thereof

A gallium nitride-based, growth substrate technology, applied in crystal growth, semiconductor devices, chemical instruments and methods, etc., can solve the problems of difficulty in widespread commercialization, high hardness and price, and reduced luminous efficiency of light-emitting devices. cost, quality improvement

Active Publication Date: 2012-07-18
ANHUI SANAN OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the lack of homogeneous single-crystal materials, device applications of GaN-based materials are usually carried out on heterogeneous substrates, most commonly sapphire (Al 2 o 3 ) substrate, because the sapphire substrate is non-conductive, hard, and expensive, and the crystal lattice of GaN grown on sapphire is not allocated as high as 13.6%, which is easy to cause lattice defects, which reduces the luminous efficiency of the light-emitting device after growth
Silicon carbide (SiC) substrates have a better lattice matching relationship than sapphire and gallium nitride, but they are expensive, and the GaN-based light-emitting device technology on it is mastered by individual large companies, so it is difficult to widely commercialize

Method used

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  • Compound gallium nitride based semiconductor growing substrate and producing method thereof
  • Compound gallium nitride based semiconductor growing substrate and producing method thereof
  • Compound gallium nitride based semiconductor growing substrate and producing method thereof

Examples

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Embodiment 1

[0018] Such as figure 1 As shown, the GaN-based material layer 130 is epitaxially grown on a compound gallium nitride-based semiconductor growth substrate based on quartz glass. The composite growth substrate includes: quartz glass 100, as the substrate of the composite growth substrate; the diamond-like film layer 110 is formed on the quartz glass as a lattice buffer layer, and its material can be Si-DLC film, C- The thickness of the DLC film, Ni-DLC or titanium carbide-DLC is 1-10000 nm; the lattice conversion layer 120 is formed on the lattice buffer layer 110 . The lattice coefficient of the lattice conversion layer is between GaN and diamond-like thin films, which matches with gallium nitride-based semiconductor materials, and nitrides (such as aluminum nitride, aluminum gallium nitride, gallium nitride, gallium nitride, etc.) can be used Indium, indium nitride or aluminum gallium indium nitride), in this embodiment, aluminum nitride (AlN) is used, with a thickness of 10...

Embodiment 2

[0025] The difference from Embodiment 1 is that this embodiment uses a metal substrate as the base of the composite growth substrate, and a seed layer 240 is added between the metal substrate 200 and the lattice buffer layer 210, which acts as an epitaxy The use of the substrate enables the GaN-based material to grow smoothly through the seed layer.

[0026] Such as figure 2 As shown, the GaN-based material layer 230 is epitaxially grown on a composite GaN-based semiconductor growth substrate based on a metal substrate. The composite growth substrate includes: a metal substrate 200 , a seed layer 240 , a lattice buffer layer 210 composed of a diamond-like film, and a lattice conversion layer 220 .

[0027] The melting point of the metal substrate 200 is preferably higher than 1000°C, and a tungsten carbide substrate, tungsten substrate, silicon carbide or steel substrate can be used. The seed layer 240 is located on the metal substrate, and its material can be chromium, tit...

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Abstract

The invention provides a compound gallium nitride based semiconductor growing substrate, which includes: a base plate, a lattice buffer layer and a lattice transferring layer, wherein the lattice buffer layer formed on a silica glass is composed of diamond-like carbon (DLC); the lattice transferring layer is formed on the lattice buffer layer and in a polycrystalline structure, the lattice coefficient is between the gallium nitride (GaN) and DLC. Ordinary base plates such as silica glass or metal base plate and the like are used for growing the gallium nitride based semiconductor materials, thereby the lattice mismatch and the thermal mismatch are caused, and due to the combination of the DLC and the nitride, the problems of the lattice mismatch and the thermal mismatch are solved, thereby the costs of existing gallium nitride based semiconductor growing substrate are reduced, simultaneously, the quality of gallium nitride based semiconductor materials which grow subsequently is improved.

Description

technical field [0001] The invention belongs to the field of semiconductor materials, and in particular relates to a composite gallium nitride-based semiconductor growth substrate and a manufacturing method thereof. Background technique [0002] Gallium nitride-based semiconductor materials are the core basic materials for preparing light-emitting devices used in the fields of semiconductor lighting and display backlighting. Due to the lack of homogeneous single-crystal materials, device applications of GaN-based materials are usually carried out on heterogeneous substrates, most commonly sapphire (Al 2 o 3 ) substrate, because the sapphire substrate is non-conductive, has high hardness and high price, and the lattice dislocation of GaN grown on sapphire is as high as 13.6%, which is easy to cause lattice defects, which reduces the luminous efficiency of the light-emitting device after growth. Silicon carbide (SiC) substrates have a better lattice matching relationship tha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/12H01L33/00
CPCC30B29/406H01L33/007H01L33/005H01L33/12H01L2933/0008
Inventor 庄家铭王振祖黄惠葵范慧丽
Owner ANHUI SANAN OPTOELECTRONICS CO LTD
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