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High thermal expansion coefficient ceramic material for high-density packaging and preparation method thereof

A ceramic material and high thermal expansion technology, which is applied in the field of high thermal expansion coefficient ceramic materials for high-density packaging and its preparation, can solve problems such as not suitable for high-density packaging, facilitate mass production and popularization and application, overcome thermal mismatch, mechanical The effect of excellent performance

Active Publication Date: 2021-01-01
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Its role is mainly as a sealant and a high-performance coating for metals, metal alloys and ceramics, so it is not suitable for high-density packaging

Method used

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  • High thermal expansion coefficient ceramic material for high-density packaging and preparation method thereof
  • High thermal expansion coefficient ceramic material for high-density packaging and preparation method thereof
  • High thermal expansion coefficient ceramic material for high-density packaging and preparation method thereof

Examples

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Embodiment Construction

[0024] The present invention is further described below in conjunction with specific examples.

[0025] Table 1 shows the actual ratio and preparation process of each component of the low-temperature co-fired ceramic material with a high expansion coefficient in Examples 1 to 5 of the present invention, and Table 2 shows the properties of Examples 1 to 5 of the present invention; wherein Example 3 is prepared XRD diffraction analysis diagram and cross-sectional scanning electron microscope SEM diagram of low temperature co-fired ceramic material with high thermal expansion coefficient figure 1 , figure 2 shown.

[0026] The specific preparation process of high thermal expansion coefficient ceramic materials for high-density packaging is as follows:

[0027] Step 1: with barium hydroxide, boric acid, silicon dioxide, aluminum hydroxide, zirconium hydroxide, yttrium oxide, chromium oxide as raw material, carry out batching according to the described formula of specific embodi...

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Abstract

The invention belongs to the technical field of electronic ceramic packaging material and provides a high-thermal-expansion-coefficient ceramic material for high density packaging and a preparation method thereof so as to overcome the problem of thermal expansion mismatch of existing chip packaging materials. The ceramic material of the invention comprises the following ingredients (by weight): 55-70% of SiO2, 20-30% of BaO, 5-10% of B2O3, 2-5% of Al2O3, 0.1-1% of Y2O3, and 1-3% of a mixture of CrO2 and ZrO2. Thermal expansion coefficient of the ceramic material is 12-15 ppm / DEG C which fits with the thermal expansion coefficient (12-18 ppm / DEG C) of a PCB. Flexure strength reaches up to 170-240 MPa, Young modulus is 50-70 GPa, mechanical property is excellent, and problems such as thermal expansion mismatch, etc. can be completely overcome. Meanwhile, the material has small dielectric constant, low loss and stable properties, and can meet requirements of high density packaging. In addition, the preparation technology is simple, mature, energy-saving and efficient, meets requirements of industrial production, and is convenient for batch production and promotion and application.

Description

technical field [0001] The invention belongs to the technical field of electronic ceramic packaging materials, in particular relates to high-density packaging materials, and specifically provides a ceramic material with a high thermal expansion coefficient for high-density packaging and a preparation method thereof. Background technique [0002] As the electronic information industry promotes the continuous development of integrated circuit systems in the direction of high density, ultra-large scale and multi-function, this makes electronic packaging technology an independent and indispensable technical system in chip manufacturing technology and system integration technology . Electronic packaging materials play a vital role in packaging technology. They mainly provide physical protection for chips such as mechanical support, electrical connection, heat dissipation and moisture resistance, and stress relaxation. The realization of these functions depends on the comprehensi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C10/14C04B35/14
CPCC04B35/14C04B2235/3215C04B2235/3217C04B2235/3218C04B2235/3225C04B2235/3241C04B2235/3244C04B2235/3409C04B2235/96C04B2235/9607
Inventor 李波李威
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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