Aqueous aluminum base solder paste
A brazing-based, water-based technology, applied in the direction of welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of poor environmental performance and storage difficulties of aluminum-based brazing paste, and achieve easy cleaning, easy storage, strong The effect of stability
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Embodiment 1
[0017] A water-based aluminum-based brazing paste is composed of the following components: aluminum alloy brazing powder accounting for 65% of the total weight of the water-based aluminum-based brazing paste, and the aluminum alloy is composed of: Al 90%, Si 10% ; Account for the soldering flux of 20% of the total weight of the solder paste, the weight percentage of the soldering flux is composed of: AlF 3 54%, KF 46%; account for the paste body of 15% of the total weight of the solder paste, the weight percentage of the paste body is composed of: sodium carboxymethyl cellulose 1%, hydroxyethyl cellulose 1%, polyoxygen Ethylene 3%, water 20%, formamide 70%, propylene glycol 5%.
Embodiment 2
[0019] The solder paste of this example is composed of: aluminum alloy base solder powder accounting for 30% of the total weight of the solder paste, and the weight percentage of the aluminum alloy is composed of: Al 88%, Si12%; accounting for 30% of the total weight of the solder paste, its weight The percentages are grouped into: AlF 3 43.2%, KF 36.8%, NaF 15%, KCl 5%; accounting for 40% of the total weight of the solder paste, its weight percentage is composed of: ethyl cellulose 10%, polyvinylpyrrolidone 5%, N, N- Dimethylformamide 40%, N-methylpyrrolidone 25%, ethylene glycol 20%.
Embodiment 3
[0021] The solder paste of this example is composed of: aluminum alloy-based solder powder accounting for 60% of the total weight of the solder paste, and the weight percentage of the aluminum alloy is: Al 62%, Si10%, Cu 28%; accounting for 10% of the total weight of the solder paste Soldering flux, its weight percentage composition: AlF3 48.5%, KF 41.5%, CsF 10%; Accounting for the paste body of 30% of the total weight of solder paste, its weight percentage composition is: hydroxypropyl cellulose 1%, polyethylene oxide 1 %, water 13%, formamide 30%, dimethylformamide 60%, ethanol 5%, glycerol 10%.
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