High thermal conductivity metal-based composite material with hierarchical structure, and preparation method thereof

Abstract

The invention discloses a high thermal conductivity metal-based composite material with a hierarchical structure, and a preparation method of the high thermal conductivity metal-based composite material; the high thermal conductivity metal-based composite material and the preparation method are characterized in that a first stage composite material (composite material I) is formed by at least one nano-reinforced body and a metallic matrix, and a second stage composite material (composite material II) is formed by at least one micron-reinforced body and the composite material I, wherein the nano-reinforced body is selected from graphene, a carbon nano tube, carbon nano-fiber, a nano-graphite flake and nano-diamond, and at least has the size of 1-100nm along the one-dimensional direction; and the micron-reinforced body is selected from diamond, silicon carbide and silicon, and has the equivalent grain size of 30-600 mu m. The composite material has low and controllable coefficient of thermal expansion, high heat conductivity, thus being used as various heat management materials.

Description

technical field [0001] The invention belongs to the technical field of high thermal conductivity metal matrix composite materials, and provides a high thermal conductivity metal matrix composite material with hierarchical structure and a powder metallurgy preparation method thereof. Background technique [0002] In recent years, in order to meet the development needs of electronic technology, the research of high thermal conductivity and low expansion metal matrix composites used as thermal management materials has made great progress. The application of high thermal conductivity reinforcements (such as diamond, silicon carbide, silicon, carbon fiber, and highly oriented pyrolysis graphite, etc.) makes the thermal conductivity of metal matrix composites reach or even exceed that of pure copper (>400W / mK), which can meet the requirements of current electronic technology. For the development of high thermal conductivity requirements. However, the thermal expansion coeffici...

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Problems solved by technology

It can be seen that in the micron-scale particle grading, the reduction of the thermal expansion coefficient is achieved by increasing the volume content of the reinforcement, but the high volume content will lead to: (1) the brittleness of the composite material increases, the difficulty of densification increases, and the composite material The thermal conductivity does not increase but decreases; (2) The damping performance of the composite material decreases, making it difficult to guarantee the working stability and service life in complex service conditions (such as vibration, accelerated motion, etc.)

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