Laser multipoint focusing processing system

Abstract

The invention discloses a laser multipoint focusing processing system, wherein the structure of the system is as follows: a laser, a beam expander, a light guide lens, a focusing lens and first and second total reflection mirrors are sequentially located on the same light path, the first total reflection mirror is a spherical mirror or non-spherical mirror processed with a minipore at the middle part, and the curvature radius of the first total reflection mirror is smaller than a half of the minimal distance between the two total reflection mirrors; at work, the concave surface of the first total reflection mirror faces to an xy two-dimensional work table, and the optical axis of the first total reflection mirror is overlapped with the optical axis of the laser; the centre of the minipore is overlapped with the optical axis of the laser; and the position of the focusing lens is adjustable up and down, and the distance between the two total reflection mirrors is adjustable. The system can convert a single focusing point introduced by the laser to a transparent material into a plurality of focusing points with the same optical axis, thereby improving the laser energy absorption uniformity of the cut and separated transparent brittle material along the thickness direction so as to reinforce the heating uniformity of the transparent material along the thickness direction and sharply reduce the stress difference along the thickness direction to cut and separate the transparent brittle material in high quality, high efficiency and high success rate.

Description

technical field [0001] The invention belongs to the technical field of laser processing applications, and in particular relates to a laser multi-point focusing processing system. Background technique [0002] At present, the laser cutting and separation of transparent and brittle materials (such as glass, quartz glass and optical glass, etc.) basically adopts the crack control method. This method uses a focusing lens to focus the laser beam on the surface or somewhere inside the transparent material, and uses the high absorption rate of the transparent material for a certain laser beam (such as a laser beam in the 10.6 μm band) to form a surface that absorbs laser light energy to make the transparent material transparent. Heating the surface of the brittle material; or using the low absorption rate of the transparent brittle material to a certain laser beam (such as the laser beam in the 1.064μm band), let the laser beam penetrate the entire transparent brittle material, for...

AI Technical Summary

Problems solved by technology

As a result, it is difficult to control the direction of cracks generated by thermal stress, and transparent and brittle materials are prone to cracks in any direction along the thickness direction, resulting in the overall bursting of the material

Even for thin transparent brittle materials, non-uniform absorption of laser energy through the thickness can lead to loss of control along the desired separation path, especially when cutting curved trajectories with less separation curvature

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