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Vinyl ester resin, vinyl ester resin compound and preparation method thereof

A vinyl ester resin and composition technology, applied in the field of vinyl ester resin, can solve problems such as large gas volume, and achieve the effects of reducing the amount of bubbles, simplifying the curing process, and shortening the process time

Inactive Publication Date: 2012-09-12
SWANCOR ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Aiming at the problem that a large amount of gas is generated during the curing process of vinyl ester resins, the present invention provides a vinyl ester resin, a preparation method thereof, and a vinyl ester resin composition

Method used

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  • Vinyl ester resin, vinyl ester resin compound and preparation method thereof
  • Vinyl ester resin, vinyl ester resin compound and preparation method thereof
  • Vinyl ester resin, vinyl ester resin compound and preparation method thereof

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preparation example Construction

[0047] The preparation method of the above -mentioned ethylene ester resin of the present invention is as follows: a mixture containing epoxy structures and unsaturated one -mout the carboxylic acid for opening a ring polymerization reaction. While the reaction of the opening of the ring, compared to the reaction of the 100 weight portion,Things, further add 0.01 to 10 unsaturated dual carboxylic acids.

[0048] Among them, a mixture containing epoxy structures and unsaturated one yuan carboxylic acid Moore is preferably 1 to 0.8 to 1.2, and it is best to be 1 to 0.9 to 1.1.

[0049] The compounds containing epoxy structures can be bisphenol -A -type epoxy resin, bisphenol -F -type epoxy resin, phenol -type epoxy resin, tetrazabine bisphenol epoxy resin, and rubber -modified epoxy resinAny type, but not limited to the above choices.

[0050] The unsaturated unit acid that can be used in the opening polymerization reaction can be used in one of one of the unsaturated unit acids, wh...

Embodiment 1

[0061] 0.1 g ingine binary acid, 100g of bisphenol A type A type of ethylene -based ethylene -based ethylene ethylene -based ethylene ethylene -based, mixed uniformly to prepare a bisphenol -type ethylene ester resin.

Embodiment 2

[0063] 0.5g of antibutonic acid, 100g of bisphenol -type ethylene -based ethylene -based ethylene -based ethylene ethylene -based ethylene ethylene -based, mixed uniformly to prepare a bisphenol A type ethyl ester resin.

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Abstract

The invention provides vinyl ester resin, a vinyl ester resin compound and a preparation method thereof. The vinyl ester resin contains a vinyl ester functional group represented by a structural formula (I). The vinyl ester resin compound comprises, by weight, 100 parts of vinyl ester resin, 0.01-10 parts of unsaturated binary carboxylic acid and 30-50 parts of vinyl monomer and / or acrylic monomer. The vinyl ester resin compound effectively reduces the bubble amount generated in the solidifying process, improves the performance and the appearance of products, simplifies technological process and shortens the process time.

Description

Technical field [0001] The present invention involves a vinyl ester resin, especially a ethylene resin, ethyl ester resin composition and preparation method that can reduce the amount of bubbles during the solidification process. Background technique [0002] Ethyl ester resin, a molecular ends with ethylene -based energy groups, unsaturated polyester resins with epoxy resin in the middle skeleton, are generally obtained by epoxy resin and ethylene carboxylic acids.The basic chain segment of epoxy resin has been retained, and has excellent process performance of unsaturated polyester, with excellent corrosion resistance and mechanical properties, and is convenient for processing. Therefore, since the 1960s,The rapid development has been widely used in fields such as petroleum, paper, medicine, food, and architecture. [0003] For example, CN1234748C's open ethylene ethylene ester resin has a high molecular weight. When it is curing at room temperature, the contraction rate is low...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/17C08G59/16C08L63/10C08K5/092C08K5/09C08K5/01C08K5/101C08K5/103C08K5/13
Inventor 谢宗廷谢佳纯
Owner SWANCOR ADVANCED MATERIALS CO LTD
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