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Vibration transducer

A technology of vibrating transducers and vibrating beams, which is applied in the direction of vibrating fluids, instruments, and electromagnetic means, etc., can solve the problems of narrowing distances and ineffective electrostatic forces, so as to reduce the contact area and prevent mode Effect of crossing and improving vibration stability

Active Publication Date: 2014-09-17
YOKOGAWA ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0062] Furthermore, when the electrostatic force is selected for the driving force used to vibrate the vibrating beam, the electrostatic force cannot function effectively unless the distance between the driving electrode and the vibrating beam is narrowed to about 1 μm

Method used

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Embodiment Construction

[0145] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0146] Figure 1A-1B as well as Figure 2-Figure 15 is a diagram for explaining the structure of the main part of the embodiment of the present invention.

[0147] Figure 1A-1B is a diagram for explaining the assembly structure of the main part. Figure 1A is the floor plan of the main part, Figure 1B is its cross-sectional view. Figure 1 to Figure 15 is a diagram for explaining the manufacturing process.

[0148] In the attached figure, represented by the Figure 29 Components marked with the same reference numerals have the same function accordingly.

[0149] The following only describes the Figure 29 different parts.

[0150] exist Figure 1A with Figure 1B , each of the first and second vibrating beams 32 a and 32 b is arranged in a vacuum chamber 33 . Tensile strain is applied to the substrate 31 in these vibration beams. The first and se...

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Abstract

The invention provides a vibration transducer. The vibration beam is arranged on the substrate parallel to the substrate and parallel to each other, and is arranged in a vacuum chamber formed by the housing and the substrate. Each vibrating beam has a cross-sectional shape in which a cross-sectional thickness in a direction perpendicular to the substrate surface is greater than a cross-sectional thickness in a direction parallel to the substrate surface. The first electrode plate is arranged parallel to the substrate surface and connected to one end of each vibration beam. The second electrode plate is arranged parallel to the substrate surface and between the vibrating beams. The third and fourth electrode plates are arranged on opposite sides of the vibrating beam. The rough parts are arranged in the surfaces of the vibration beam and the opposite side wall portions of the second, third and fourth electrode plates.

Description

technical field [0001] The invention relates to a vibration transducer. Background technique [0002] Figure 29 to Figure 38 is a diagram for explaining the structure of a main part as an example of the prior art generally adopted so far. [0003] Figure 29 is a diagram for explaining the assembly structure of the main part. Figure 30 to Figure 38 is a diagram for explaining the process of making it. [0004] Description will be made in terms of manufacturing processes. [0005] exist Figure 30 In the present invention, a silicon oxide film 10a is formed and patterned on an N-type silicon single crystal substrate 1 . [0006] The portion from which the oxide film has been removed is undercut to form a concave portion, and doping with a concentration of 10 18 cm -3 Selective epitaxial growth of p-type silicon with boron to grow p+ monocrystalline silicon layer 11 . [0007] Next, by doping with a concentration of at least 3×10 19 cm -3 The p-type silicon of boro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B06B1/02
CPCG01L1/106G01L9/0019G01P15/097G01H11/00
Inventor 吉田隆司
Owner YOKOGAWA ELECTRIC CORP
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