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Modified nonmetallic reclaimed material of printed circuit board and preparation method thereof

A technology of non-metallic recycled materials and printed circuit boards, which is applied in chemical recycling, chemical instruments and methods, fibrous fillers, etc., can solve the problem of poor dispersion of PCB non-metallic recycled materials, inability to effectively improve the blending application effect, and interphase Low adhesion and other problems, to achieve the effect of improving the use value, improving physical and mechanical properties, and thickening the phase interface

Active Publication Date: 2012-09-19
江苏嘉铂新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor dispersion of high-fineness PCB non-metallic recycled materials, it has a great tendency to agglomerate; at the same time, because of its inert thermosetting structure, its compatibility with plastic substrates is also poor; even the blend system The mixed components are still divided into independent phases, the interphase adhesion is small, the surface tension is large, and the compatibility is not good, which cannot effectively improve the effect of blending applications

Method used

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  • Modified nonmetallic reclaimed material of printed circuit board and preparation method thereof
  • Modified nonmetallic reclaimed material of printed circuit board and preparation method thereof
  • Modified nonmetallic reclaimed material of printed circuit board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Example 1 Modification of PCB non-metallic recycled materials applied to polyethylene / PE profiles and processing of composite materials

[0030] 1000Kg of PCB non-metallic recycled material with a particle size of 200μm-500μm separated from the metal-rich body is sent to the mixer, and compound additives are added according to the following ratio:

[0031] Grinding aid: Sodium lignosulfonate 10 Kg (the dosage of sodium lignosulfonate is 1% of the weight of PCB non-metallic recycled materials);

[0032] Active dispersant: glyceryl monostearate (Wuhan Jinnuo Chemical Co., Ltd.) 10 Kg, zinc stearate (Nantong Huizhi Chemical Co., Ltd.) 5Kg (the amount of active dispersant is 1.5% of the weight of PCB non-metallic recycled materials );

[0033] Compatibility modifier: polyethylene oligomer (produced by Jiande Huachen Chemical Co., Ltd., white powder, softening point ℃: 55 ℃, viscosity CPS 140 ℃ 40MAX, penetration 25 ℃: 3~8, average Molecular weight: 2000-5000, thermal weig...

Embodiment 2

[0039] Example 2: Compatibility treatment of PCB non-metallic recycled materials applied to polyester FRP profiles and processing of composite materials

[0040] 1000Kg of PCB non-metallic recycled material with a particle size of 200μm-500μm separated from the metal-rich body is sent to the mixer, and compound additives are added according to the following ratio:

[0041] Grinding aid: 10 Kg of sodium silicate (the dosage of the grinding aid sodium silicate is 1% of the weight of PCB non-metallic recycled materials);

[0042] Active dispersant: sodium tripolyphosphate 10Kg (the amount of active dispersant sodium tripolyphosphate is 1% of the weight of PCB non-metallic recycled materials);

[0043] Compatibility modifier: vinyl acetate 30Kg, unsaturated polyester resin (Shenzhen Yoshida Chemical Co., Ltd., 191#) 10Kg (the amount of compatibilization modifier is 4% of the weight of PCB non-metallic recycled materials).

[0044] After uniform stirring, the material is discharge...

Embodiment 3

[0049] Example 3: Compatibility treatment of PCB non-metallic recycled materials applied to polyester FRP profiles and processing of composite materials

[0050] 1000Kg of PCB non-metal reclaimed material with metal-enriched bodies with a particle size of 200μm-500μm has been separated, sent to the mixer, and compound additives are added according to the following ratio:

[0051] Grinding aid: 50 Kg of sodium silicate (the dosage of the grinding aid sodium silicate is 5% of the weight of PCB non-metal recycled materials);

[0052] Active dispersant: sodium tripolyphosphate 30Kg (the amount of active dispersant sodium tripolyphosphate is 3% of the weight of PCB non-metallic recycled materials);

[0053] Compatibility modifier: phenolic resin (Wuxi Guangming Chemical Co., Ltd., 2124) 50Kg (the amount of phenolic resin used as a compatibilizing modifier is 5% of the weight of PCB non-metallic recycled materials).

[0054] After uniform stirring, the material is discharged into t...

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Abstract

The invention discloses modified nonmetallic reclaimed material of a printed circuit board (PCB). The modified nonmetallic reclaimed material is prepared by a method comprising the following steps: after adding a compound assistant into nonmetallic reclaimed material of the printed circuit board and uniformly mixing, carrying out superfine crushing to obtain the modified nonmetallic reclaimed material of the printed circuit board, wherein the compound assistant comprises a crushing assistant, an active dispersing agent and a compatibilization modifier, the amount of the crushing assistant is 0.01%-10% of the weight of the nonmetallic reclaimed material of the printed circuit board, the amount of the active dispersing agent is 0.01%-10% of the weight of the nonmetallic reclaimed material of the printed circuit board, and the amount of the compatibilization modifier is 0.01%-10% of the weight of the nonmetallic reclaimed material of the printed circuit board. A finished fine power product of the modified nonmetallic reclaimed material of PCB has the advantages of effectively improved dispersion uniformity, interface compatibility and interface binding force, a mixing proportion can be increased, an application range is enlarged and application value is improved.

Description

technical field [0001] The invention belongs to the technical field of recycling resources of waste printed circuit boards. In particular, it relates to a modified printed circuit board non-metal reclaimed material and a preparation method thereof. Background technique [0002] Metal recycling in printed circuit boards (PCB) has high economic value, and related technologies are relatively mature; non-metallic materials account for about 50-80% of the total, and its components are mainly composed of glass fibers and polymers, generally containing 40 % of organic matter (resin, brominated flame retardant, dicyandiamide curing agent, curing accelerator, etc.), 60% of inorganic matter (ceramics and glass fibers made of various oxides such as silicon and aluminum as the main body). Due to specific chemical treatment, PCB non-metallic recycled materials can withstand high thermodynamic tests and harsh environmental conditions, high temperature resistance, aging resistance, and di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/06C08L67/00C08L67/06C08L61/06C08L97/00C08K13/02C08K5/103C08K5/101C08K5/098C08K3/34C08K3/32C09C1/28C09C1/40C09C3/10C09C3/08C09C3/06C09C3/04
CPCY02P20/582
Inventor 周子凯邹玥刘扬生
Owner 江苏嘉铂新材料有限公司
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