Trench gate charge storage type insulated gate bipolar transistor (IGBT)

A technology of charge storage and charge storage layer, which is applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of reduced device breakdown voltage and small device breakdown voltage, and achieve optimal compromise, good breakdown voltage, and shielding adverse effects

Inactive Publication Date: 2012-09-19
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for the CSTBT device structure, due to the existence of the N-type charge storage layer with a higher doping concentration, the breakdown voltage of the device is significantly reduced. The higher the doping concentration of the N-type charge storage layer, the smaller the breakdown voltage of the device.
The effect of the doping concentration of the N-type charge storage layer on the breakdown voltage of the device limits the optimal compromise of the breakdown voltage, forward conduction voltage drop and turn-off time of the CSTBT structure

Method used

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  • Trench gate charge storage type insulated gate bipolar transistor (IGBT)
  • Trench gate charge storage type insulated gate bipolar transistor (IGBT)
  • Trench gate charge storage type insulated gate bipolar transistor (IGBT)

Examples

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Embodiment Construction

[0018] A trench gate charge storage type IGBT, such as figure 2 shown, including P + collector 12, located at P + The metal collector 11 on the back of the collector 12 is located at P + The N on the front of the collector 12 + Electric field blocking layer 13, located at N + N on the surface of the electric field stop layer 13 - Drift zone 14, located at N - The P-type base region 21 in the middle of the top of the drift region 14, and the two Ns located inside the P-type base region 21 + The contact region 20 is located inside the P-type base region 21 and is located between the two N + P between the contact area 20 + Contact region 19, located on the device surface and connected to two N + Contact zone 20 and P + The metal emitter 18 contacted by the contact region 19 is located on two grooved gate electrodes 16 on both sides of the device, and the bottom surface of the grooved gate electrode 16 passes through the gate oxide layer 15 and the N - The drift region ...

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Abstract

The invention discloses a trench gate charge storage type IGBT and belongs to the technical field of power semiconductor devices. Based on traditional trench gate charge storage type IGBTs, a P-shaped buried layer is introduced on the upper portion of a N-shaped drifting area of a device, by the aid of an attached PN junction introduced by the P-shaped buried layer and the electric field modulating effect, negative influences of a highly doped N-shaped charge storage layer on the breakdown voltage of the device is shielded, and the device can acquire high breakdown voltage. The P-shaped buried layer has an electric field shielding effect on the N-shaped charge storage layer, high doping concentration of the N-shaped charge storage layer can be adopted, the conductivity modulation in the N-shaped drifting area of the device can be strengthened, and the distribution of current carriers in the N-shaped drifting area is optimized, so that the device can acquire low and good forward voltage drop and good turn-off loss compromise. The trench gate charge storage type IGBT is applicable to fields of semiconductor power devices ranging from low power to high power and power integrated circuits.

Description

technical field [0001] The invention belongs to the technical field of power semiconductor devices, and relates to an insulated gate bipolar transistor (IGBT), in particular to a trench gate charge storage type insulated gate bipolar transistor (CSTBT). Background technique [0002] Insulated Gate Bipolar Transistor (IGBT) is a new type of power electronic device combining MOS field effect and bipolar transistor. It not only has the advantages of easy driving and simple control of MOSFET, but also has the advantages of low conduction voltage of power transistor, large on-state current and small loss. It has become one of the core electronic components in modern power electronic circuits and is widely used in Various fields of the national economy such as communications, energy, transportation, industry, medicine, household appliances and aerospace. The application of IGBT plays an extremely important role in improving the performance of power electronic systems. [0003] S...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/739H01L29/06
CPCH01L29/7397
Inventor 张金平夏小军李长安张蒙安俊杰李泽宏任敏张波
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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