Trench gate charge storage type insulated gate bipolar transistor (IGBT)
A technology of charge storage and charge storage layer, which is applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of reduced device breakdown voltage and small device breakdown voltage, and achieve optimal compromise, good breakdown voltage, and shielding adverse effects
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[0018] A trench gate charge storage type IGBT, such as figure 2 shown, including P + collector 12, located at P + The metal collector 11 on the back of the collector 12 is located at P + The N on the front of the collector 12 + Electric field blocking layer 13, located at N + N on the surface of the electric field stop layer 13 - Drift zone 14, located at N - The P-type base region 21 in the middle of the top of the drift region 14, and the two Ns located inside the P-type base region 21 + The contact region 20 is located inside the P-type base region 21 and is located between the two N + P between the contact area 20 + Contact region 19, located on the device surface and connected to two N + Contact zone 20 and P + The metal emitter 18 contacted by the contact region 19 is located on two grooved gate electrodes 16 on both sides of the device, and the bottom surface of the grooved gate electrode 16 passes through the gate oxide layer 15 and the N - The drift region ...
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