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LED (light-emitting diode) chip of vertical structure

A LED chip and vertical structure technology, which is applied in the field of optoelectronic information, can solve the problems of low substrate peeling yield, etc., and achieve the effects of improving chip reliability, reducing cracks, and reducing chip leakage

Inactive Publication Date: 2012-09-26
HANGZHOU SILAN AZURE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a LED chip with a vertical structure to solve the problem of low substrate peeling yield in substrate transfer technology

Method used

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  • LED (light-emitting diode) chip of vertical structure
  • LED (light-emitting diode) chip of vertical structure
  • LED (light-emitting diode) chip of vertical structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] figure 1 It is a flowchart of a method for manufacturing a vertically structured LED chip according to Embodiment 1 of the present invention, Figure 2~7 It is a cross-sectional view of the structure in each step of the method for manufacturing a vertical LED chip according to Embodiment 1 of the present invention.

[0042] Such as Figures 1 to 7 Shown, the manufacturing method of the LED chip of described vertical structure comprises:

[0043] S101: providing a substrate;

[0044] Such as figure 2 As shown, the material of the substrate 101 can be sapphire, silicon carbide (SiC), silicon, zinc oxide (ZnO), gallium arsenide (GaAs), spinel (MgAL 2 o 4 ), and single-crystal nitrides with lattice constants close to those of nitride semiconductors. Preferably, the substrate 101 is a sapphire substrate.

[0045] S102: forming an epitaxial layer on the substrate;

[0046] Such as figure 2 As shown, an N-type nitride 102 , a light emitting layer 103 and a P-type ni...

Embodiment 2

[0072] The difference between this embodiment and the first embodiment lies in the steps after forming the second substrate, so the steps before forming the second substrate will not be described in detail.

[0073] Combine below Figure 8 to Figure 9 Each step of the method for manufacturing a vertical LED chip according to Embodiment 2 of the present invention will be described.

[0074] Such as Figure 8 As shown, first, a substrate 201 is provided, and an N-type nitride 202, a light-emitting layer 203, and a P-type nitride 204 are sequentially formed on the substrate 201, and the N-type nitride 202, the light-emitting layer 203, and the P-type The nitrides 204 together form the epitaxial layer 205; then, sequentially form a contact layer 206, a reflective layer 207, and an anti-diffusion layer 208 on the epitaxial layer 205; then, form a first substrate 209 on the anti-diffusion layer 208; then Next, the second substrate 210 is formed on the first substrate 209 . The ab...

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PUM

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Abstract

The invention discloses an LED (light-emitting diode) chip of a vertical structure, which comprises an epitaxial layer, a first substrate and a second substrate, wherein the first substrate is formed on the surface of the epitaxial layer, and the second substrate is formed on the first substrate. Through adjusting the expansion coefficients of the first substrate and the second substrate, the stress applied by the epitaxial layer can be adjusted effectively, thus the stress of the epitaxial layer in the underlayer stripping process can be released appropriately, and the generated cracking phenomenon of the epitaxial layer is reduced, thus the underlayer stripping yield is improved, the chip electricity leakage is reduced, and the chip reliability is improved.

Description

technical field [0001] The invention relates to the field of optoelectronic information technology, in particular to a LED chip with a vertical structure. Background technique [0002] Semiconductor light-emitting diode (LED) is a new type of solid-state cold light source, which has many advantages such as high efficiency, long life, small size, and low voltage. Especially in terms of energy saving and environmental protection, LED has obvious advantages over ordinary incandescent lamps and fluorescent lamps. At present, LEDs have been widely used in people's daily life. Traffic lights, car headlights, outdoor displays, mobile phone backlights, electrical indicator lights and lighting street lights have all begun to use LEDs. In the future, it has become a consensus that LEDs will replace traditional light sources as the main lighting source. However, to replace traditional light sources, LEDs need to be further improved in terms of brightness and heat dissipation. [0003]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/02
Inventor 张昊翔封飞飞万远涛金豫浙李东昇江忠永
Owner HANGZHOU SILAN AZURE