Automatic loading and unloading device for PECVD (plasma enhanced chemical vapor deposition) equipment
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 深圳市大族光伏装备有限公司
- Publication Date
- 2012-10-03
Smart Images

Figure 1 
Figure 2 
Figure 3
Abstract
Description
technical field
[0001] The invention relates to the technical field of vacuum coating, and more specifically, relates to an automatic loading and unloading device for PECVD equipment. Background technique
[0002] In the manufacturing process of silicon solar cells, it is usually necessary to use a thin film deposition process to coat silicon wafers. For example, the plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD) process can be used to vacuum silicon nitride on silicon wafers. Coating to form an anti-reflection layer on the surface of the silicon wafer. PECVD (Plasma Enhanced Chemical Vapor Deposition) is the abbreviation of plasma-enhanced chemical vapor deposition technology. Its principle is to use low-temperature plasma as an energy source, and use glow discharge to heat up the sample on the cathode of glow discharge under low pressure besides the sample. After reaching a predetermined temperature, an appropriate amount of r...