Automatic loading and unloading device for PECVD (plasma enhanced chemical vapor deposition) equipment

Abstract

The invention relates to an automatic loading and unloading device for PECVD (plasma enhanced chemical vapor deposition) equipment. The automatic loading and unloading device comprises a control module and a support. The support is provided with a boat storage workstation for storing graphite boats, a bogie, a paddle workstation and a manipulator taking and storing the graphite boats at the boat storage workstation, the bogie and the paddle workstation. The support is further provided with a horizontal moving unit and a perpendicular moving unit, wherein the horizontal moving unit is used for controlling moving of the manipulator in the horizontal direction, and the perpendicular moving unit is used for controlling moving of the manipulator in the perpendicular direction. The control module is connected with an upper computer of the PECVD equipment and used for controlling the horizontal moving unit and the perpendicular moving unit to drive the manipulator according to state signals about whether the graphite boats are on the boat storage workstation, the bogie and the paddle workstation and signals about taking and loading the graphite boats from the upper computer. The automatic loading and unloading device for the PECVD equipment is capable of accurately positioning, is high in loading and unloading efficiency, work intensity of operators is reduced, the graphite boats are protected from damage, uniformity of film plating is fine and the service lives of the graphite boats can be prolonged greatly.

Description

technical field [0001] The invention relates to the technical field of vacuum coating, and more specifically, relates to an automatic loading and unloading device for PECVD equipment. Background technique [0002] In the manufacturing process of silicon solar cells, it is usually necessary to use a thin film deposition process to coat silicon wafers. For example, the plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD) process can be used to vacuum silicon nitride on silicon wafers. Coating to form an anti-reflection layer on the surface of the silicon wafer. PECVD (Plasma Enhanced Chemical Vapor Deposition) is the abbreviation of plasma-enhanced chemical vapor deposition technology. Its principle is to use low-temperature plasma as an energy source, and use glow discharge to heat up the sample on the cathode of glow discharge under low pressure besides the sample. After reaching a predetermined temperature, an appropriate amount of r...

AI Technical Summary

Problems solved by technology

[0004] At present, PECVD vacuum coating equipment generally relies on manual use of hooks to load and unload graphite boats. Due to the relatively high PECVD vacuum coating equipment, the labor intensity is high and the work efficiency is low.

Moreover, the use of hooks to load and unload the graphite boat is easy to damage the graphite boat, shortening its life, and the silicon chip is easy to fall from the graphite boat during loading and unloading. At the same time, the precise positioning of the graphite boat cannot be completed, which is easy to cause damage to the graphite boat.

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