Pure copper plate production method, and pure copper plate

Abstract

Disclosed is a production method for a pure copper plate having a fine crystal structure, a suitable hardness, and a high special grain boundary length ratio. Further disclosed is a pure copper plate which is obtained according to the disclosed production method and which is for targets for sputtering, or anodes for plating, or similar. A pure copper ingot having a purity level of 99.96 weight% or higher is heated to 550-800°C. A hot-rolling process is carried out wherein the rolling rate is 80% or higher and the temperature at rolling completion is 500-700°C. Next, rapid cooling from the rolling completion temperature to 200°C or less is carried out at a cooling speed of 200-1000°C / min, followed by cool rolling at a rolling rate of 5-24%, and annealing.

Description

technical field [0001] The present invention relates to a method for producing a high-quality pure copper plate, and in particular, to a fine crystal structure with appropriate hardness and a high special grain boundary length ratio by partial recrystallization to form a twin crystal structure. A method for producing a pure copper plate, and a pure copper plate that is a raw material such as a target for sputtering or an anode for electroplating produced by the production method. [0002] This application claims priority based on Japanese Patent Application No. 2010-26453 for which it applied on February 9, 2010, and uses the content here. Background technique [0003] A pure copper sheet is usually produced by hot rolling or hot forging a pure copper ingot, then performing cold rolling or cold forging, and then performing heat treatment for strain relief or recrystallization to manufacture a pure copper sheet. This kind of pure copper plate is processed into the desired sh...

AI Technical Summary

Problems solved by technology

[0013] However, in the existing method of industrially producing a large-sized pure copper plate with a uniform and stable crystal structure, it is necessary to perform hot forging or hot rolling on the pure copper ingot, and then perform cold forging or cold rolling, and heat treatment. However, when the above-mentioned pure copper plate is used in a sputtering target, an anode for electroplating, or an exothermic substrate, etc., the suppression of abnormal discharge during long-term sputtering in the sputtering target and the improvement of the uniformity of in-plane dissolution in the anode for electroplating Or heat-dissipating substrates have properties such as thermal fatigue resistance, which are difficult to deal with only by miniaturization.

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