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Double-polysilicon SOI (Silicon On Insulator) SiGe HBT (Heterojunction Bipolar Transistor) integrated device based on self-aligned technology and preparation method thereof

A technology of self-alignment technology and integrated devices, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., and can solve problems such as lack of wide application and development, incompatibility of Si technology, and complexity of preparation technology compared with Si technology.

Inactive Publication Date: 2012-10-17
XIDIAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the embodiments of the present invention is to provide a dual-polycrystalline SOI SiGeHBT integrated device based on self-alignment technology and its preparation method, aiming at solving the problem that although GaAs and InP-based compound devices have superior frequency characteristics, their preparation process is more complex than Si process, High cost, difficult preparation of large diameter single crystal, low mechanical strength, poor heat dissipation performance, difficult compatibility with Si process and lack of SiO 2 Such passivation layer and other factors limit its wide application and development

Method used

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  • Double-polysilicon SOI (Silicon On Insulator) SiGe HBT (Heterojunction Bipolar Transistor) integrated device based on self-aligned technology and preparation method thereof
  • Double-polysilicon SOI (Silicon On Insulator) SiGe HBT (Heterojunction Bipolar Transistor) integrated device based on self-aligned technology and preparation method thereof
  • Double-polysilicon SOI (Silicon On Insulator) SiGe HBT (Heterojunction Bipolar Transistor) integrated device based on self-aligned technology and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Embodiment 1: Provides a method for preparing a dual polycrystalline SOI SiGe HBT integrated device and circuit with a base thickness of 20 nm by using a self-aligned process, the specific steps are as follows:

[0076] Step 1, epitaxial growth, such as figure 2 (A) Shown.

[0077] (1a) Select SOI substrate, the support material 1 of the substrate is Si, and the intermediate layer 2 is SiO 2 , The thickness is 150nm, the upper material 3 is doped with a concentration of 1×10 16 cm -3 N-type Si with a thickness of 100nm;

[0078] (1b) Using chemical vapor deposition (CVD) method, at 600℃, grow a layer of N-type epitaxial Si layer 4 with a thickness of 50nm on the upper layer of Si material as a collector area, the doping concentration of this layer is 1 ×10 16 cm -3 .

[0079] Step 2, shallow trench isolation preparation, such as figure 2 (B) and (c).

[0080] (2a) Using chemical vapor deposition (CVD), at 600℃, deposit a layer of SiO with a thickness of 300nm on the surface ...

Embodiment 2

[0109] Embodiment 2: A method for preparing a dual polycrystalline SOI SiGeHBT integrated device and circuit with a base region thickness of 40 nm using a self-aligned process is provided. The specific steps are as follows:

[0110] Step 1, epitaxial growth, such as figure 2 (A) Shown.

[0111] (1a) Select an SOI substrate, the lower support material 1 of the substrate is Si, and the intermediate layer 2 is SiO 2 , The thickness is 300nm, the upper material 3 is doped with a concentration of 5×10 16 cm -3 N-type Si with a thickness of 120nm;

[0112] (1b) Using the chemical vapor deposition (CVD) method, at 700℃, grow a layer of N-type epitaxial Si layer 4 with a thickness of 80nm on the upper Si material as a collector area, the doping concentration of this layer is 5 ×10 16 cm -3 .

[0113] Step 2, shallow trench isolation preparation, such as figure 2 (B) and (c).

[0114] (2a) Using chemical vapor deposition (CVD) method, at 700℃, deposit a layer of SiO with a thickness of 400n...

Embodiment 3

[0143] Embodiment 3: Provides a method for preparing a dual polycrystalline SOI SiGeHBT integrated device and circuit with a base region thickness of 60 nm by using a self-aligned process, the specific steps are as follows:

[0144] Step 1, epitaxial growth, such as figure 2 (A) Shown.

[0145] (1a) Select an SOI substrate, the lower support material 1 of the substrate is Si, and the intermediate layer 2 is SiO 2 , The thickness is 400nm, and the upper material 3 is doped with a concentration of 1×10 17 cm -3 N-type Si with a thickness of 150nm;

[0146] (1b) Using the chemical vapor deposition (CVD) method, at 750℃, grow a layer of N-type epitaxial Si layer 4 with a thickness of 100nm on the upper Si material as a collector area, the doping concentration of this layer is 1 ×10 17 cm -3 .

[0147] Step 2, shallow trench isolation preparation, such as figure 2 (B) and (c).

[0148] (2a) Using chemical vapor deposition (CVD), at 800℃, deposit a layer of SiO with a thickness of 500nm ...

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Abstract

The invention is suitable for the technical field of semiconductor integrated circuit and provides a double-polysilicon SOI (Silicon On Insulator) SiGe HBT (Heterojunction Bipolar Transistor) integrated device based on self-aligned technology and a preparation method thereof. The preparation method comprises the following steps: growing N-type Si epitaxy on an SOI substrate; photoetching a shallow slot isolation region; preparing shallow slot isolation; etching and injecting phosphonium ions to form a collector contact region; depositing SiO2, P-Poly-Si, SiO2 and nitride in sequence; carrying out dry etching to form a nitride side wall; carrying out wet etching to form a base region window; selectively growing a SiGe base region; depositing N-type Poly-Si; then removing Poly-Si outside an emitter to form an HBT (Heterojunction Bipolar Transistor); and finally photoetching an emitter region, the base region and a collector region pin hole, metalizing, photoetching a lead wire to form an HBT integrated circuit in which the thickness of the base region is 20-60nm. The technique provided by the invention is compatible with the existing CMOS (Complementary Metal-Oxide-Semiconductor) integrated circuit processing technology, and can prepare the integrated circuit of a BiCMOS (Bipolar-Complementary Metal-Oxide-Semiconductor) device based on SOI under the condition of little capital and equipment investment so that the performance of the existing analog and digital-analog hybrid integrated circuit is greatly improved.

Description

Technical field [0001] The invention belongs to the technical field of semiconductor integrated circuits, and in particular relates to a dual polycrystalline SOI SiGe HBT integrated device based on a self-aligned process and a preparation method. Background technique [0002] Integrated circuits are the cornerstone and core of the economic development of the information society. As the U.S. engineering technology community recently mentioned the fifth electronic technology among the 20 greatest engineering achievements in the world in the 20th century, “from vacuum tubes to semiconductors and integrated circuits, it has become the cornerstone of intelligent work in various industries today.” One of the typical products that best reflects the characteristics of the knowledge economy. At present, the electronic information industry based on integrated circuits has become the world's largest industry. With the development of integrated circuit technology, the clear boundaries betw...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/84
Inventor 胡辉勇宋建军王斌张鹤鸣宣荣喜王海栋周春宇郝跃
Owner XIDIAN UNIV
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