Chip integrating silicon micro microphone and complementary metal oxide semiconductor (CMOS) integrated circuit and manufacturing method of chip

Abstract

The embodiment of the invention discloses a chip integrating a silicon micro microphone and a complementary metal oxide semiconductor (CMOS) integrated circuit and a manufacturing method of the chip. The chip takes a silicon wafer as a substrate, and one surface of the silicon wafer is divided into two areas, namely a CMOS integrated circuit area and a silicon micro microphone area, wherein the silicon micro microphone area comprises two or more micro-electromechanical system (MEMS) acoustic transducers which are connected with one another in series, in parallel or in a difference mode, and the MEMS acoustic transducers are electrically connected with one another through electrical connection paths in the chip and the MEMS acoustic transducers are also electrically connected with the CMOS integrated circuit through electrical connection paths in the chip. On the one hand, the embodiment of the invention can significantly promote the overall performance, the size and the power consumption of an MEMS microphone relative to a multi-chip integration mode, and on the other hand, the embodiment of the invention can improve the total signal-to-noise ratio gain of the MEMS microphone relative to the chip only integrating a single MEMS acoustic transducer.

Description

technical field [0001] The invention relates to a chip integrating a silicon micro-microphone and a CMOS (Complementary Metal Oxide Semiconductor, Complementary Metal Oxide Semiconductor) integrated circuit and a manufacturing method thereof. Background technique [0002] MEMS microphone is a microphone with many applications and better performance at present, and MEMS acoustic transducer and CMOS integrated circuit are arranged on the circuit board inside its packaging structure. Previously, MEMS devices and CMOS integrated circuits generally adopted a multi-chip integration method, that is, different manufacturers used different processes to independently complete the manufacture of MEMS chips and CMOS integrated circuits, and then packaged and integrated the two into one device unit; The manufacturing process of an integrated method is mature, and the design and manufacture of MEMS devices can be optimized separately. The disadvantage is that the MEMS device and the CMOS ...

AI Technical Summary

Problems solved by technology

[0004] The rapid development of consumer electronics requires MEMS microphones with better sound quality, but the noise floor of MEMS microphones is related to the design of MEMS microphones, which is limited to the structural design of MEMS microphones, and it is quite difficult to further improve the signal-to-noise ratio of MEMS microphones

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