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Silver alloy wire and preparation method thereof

A silver alloy and surplus technology, applied in the field of silver alloy wire, can solve the problems of bonded silver wire being easily sulfided and corroded, and achieve the effects of reducing electrochemical corrosion, improving wettability and casting performance, and reducing work hardening

Active Publication Date: 2014-01-08
YANTAI YINUO SEMICON MATERIAL CO LTD
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a silver alloy wire and its preparation method, to improve the material performance through alloy technology, so as to overcome the problem that the bonding silver wire in the prior art is easily corroded by sulfidation

Method used

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  • Silver alloy wire and preparation method thereof
  • Silver alloy wire and preparation method thereof
  • Silver alloy wire and preparation method thereof

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Embodiment Construction

[0033] The present invention will be further described below in conjunction with specific examples.

[0034] Prepare silver alloy wire according to the proportioning listed in Table 1 (surplus is silver),

[0035] Table 1 Raw material ratio embodiment

[0036]

[0037] The preparation process is carried out according to the following steps:

[0038] a. Silver raw material: choose silver with a purity of more than 99.999%;

[0039] b. Melting and casting: Add the various metals mentioned in proportion to the 80% silver raw material, and melt and cast it into a round bar through pre-alloying, master alloy and directional continuous drawing casting process;

[0040] c. Wire drawing: the round bar is drawn into a wire by a wire drawing machine;

[0041] d. Annealing;

[0042] e. Mechanical performance testing;

[0043] f. Winding: the wire is divided into small shafts of different lengths.

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Abstract

The invention relates to a silver alloy wire and a preparation method thereof. The silver alloy wire is prepared from the following components of 0.5-10 percent of Au, 0-1 percent of Pt, 1-6 percent of Pd, 0-1 percent of Rh, 0-1 percent of Cu, 0-500ppm of Ln, 0-200ppm of Ce, 0-0.5 percent of Al, 0.7-3 percent of Ti, 0-0.2 percent of Si, 0-0.3 percent of Zn, 0-1 percent of Sn, 0-10 percent of Be and the balance of Ag. A directional continuous casting process is adopted. The prepared silver alloy wire overcomes the problem that the bonded silver wire is easily subjected to sulfur corrosion in the prior art, and has a series of other excellent characteristics.

Description

technical field [0001] The invention relates to a silver alloy wire and a preparation method thereof. Background technique [0002] Bonding Wires is one of the key materials of semiconductor packaging, as the main connection material between the chip and the external circuit, it plays the role of current conduction between the chip and the external circuit. [0003] The existing bonding wires mainly include bonding gold wires, bonding copper wires, bonding silver wires and the like. Bonding gold wire has high corrosion resistance and high conductivity, and is widely used in medium and high-end products in the microelectronics industry. However, the cost of gold wire is expensive. In order to reduce the packaging cost, various gold wire substitutes have been introduced one after another. Among them, the bonding copper wire is relatively mature and has begun to be used, but due to its easy oxidation and high hardness, it can only be used in some low-end products. Although s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C5/06B22D11/00C22F1/14
Inventor 林良
Owner YANTAI YINUO SEMICON MATERIAL CO LTD
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