Low dielectric and high heat-resistant epoxy resin composition and its preparation method

Abstract

The invention relates to high performance resin systems used as dielectric materials, in particular to a low dielectric high heat-resistant epoxy resin composition and its preparation method. Based on the technical problem of poor compatibility in existing polyphenylene ether modified epoxy resin, the invention puts forward the scheme of using polyphenylene ether grafted maleic anhydride and an active diluent to reduce the system viscosity so as to solve the compatibility of polyphenylene ether and epoxy resin, thus improving the dielectric and mechanical properties of the system. By adding a proper amount of TGIC (triglycidyl isocyanurate) to improve the heat resistance of the resin system, a low dielectric and high heat-resistant high performance epoxy resin composition can be prepared.

Description

technical field [0001] The invention relates to a high-performance resin system used as a dielectric material, in particular to a low-dielectric and high-heat-resistant epoxy resin composition and a preparation method thereof. Background technique [0002] Epoxy resin is widely used in copper clad laminate substrate materials due to its excellent adhesive properties, easy modification, low cost and good processability. However, with the development of semiconductor microelectronics in recent years, general performance copper clad laminates have been It cannot meet the needs of high frequency, high speed, high heat resistance, low dielectric, and low loss. Therefore, it is of great significance to develop resins for copper clad laminates with low dielectric constant and high heat resistance, and the preparation of high performance resin systems is the most important one of the effective methods. [0003] Polyphenyl ether (PPE for short), has a high glass transition temperatu...

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Problems solved by technology

[0002] Epoxy resins are widely used in copper clad laminate substrate materials due to their excellent adhesive properties, easy modification, low cost and good processability, In recent years, due to the development needs of semiconductor microelectronics, copper clad laminates with general performance can no longer meet the needs of high frequency, high speed, high heat resistance, low dielectric, and low loss. Therefore, copper clad laminates with low dielectric constant and high heat resistance have been developed. The use of resin is of great significance, and preparing a high-performance resin system is one of the most effective methods

[0003]Polyphenyl ether (PPE for short) has a high glass transition temperature (Tg=210 ℃), low dielectric constant (Dk=2.45 at 1MHz) and low dissipation factor (Df=0.0007), good dimensional stability and other advantages, so it is used for the modification of epoxy resin; Higher than 21000g / mol), poor fluidity, difficult processing and other shortcomings make it limited in modifying epoxy resin; there are two ways to solve this problem: one is to reduce the molecular weight of polyphenylene ether, the molecular weight of polyphenylene ether The smaller it is, the less likely it is to separate from epoxy resin (Merfeld G D, Yeager G W, Chao H S, et al. Phase behavior and morphology of Poly(phenylene ether) / epoxy blend. Polymer, 2003(44): 4981- 4992); The second is functionalized polyphenylene ether, that is, functionalized monomers that can react with epoxy are grafted on polyphenylene ether; usually modifiers include fumaric acid, epichlorohydrin, bisphenol A, maleic anhydride, etc. ; Through these two common methods, there is indeed a certain effect in improving the compatibility of polyphenylene ether and epoxy. US Patent US005843565A discloses a low molecular weight polyphenylene ether and epoxy resins with different epoxy values The application of the cured product in the copper clad laminate base material is to degrade polyphenylene ether into a very small molecular weight to achieve the purpose of improving the compatibility between polyphenylene ether and epoxy resin; but the test results show that with With the reduction of the molecular weight of polyphenylene ether, the dielectric constant is also increased while the compatibility with epoxy resin is improved, which does not meet the requirements of high-performance copper clad laminates; Chinese patent CN1385454 discloses a epoxy-based Cross-linked polyphenylene ether PPE resin, the modified polyphenylene ether has epoxy groups at the end, so the compatibility with epoxy resin is greatly improved

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