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Ultrathin palladium plating and gold plating process for lead wire frame

A lead frame and lead frame technology, applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as cost increase, achieve cost saving, stable contact resistance, and reduce the use of precious metals.

Active Publication Date: 2015-03-25
ACKOTEC ZHONGSHAN ELECTRONICS PARTS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as precious metal prices continue to rise, so do costs
In this way, it is technically faced with the challenge of how to reduce the thickness of the gold / palladium layer to save costs while maintaining or even improving the quality and reliability of the lead frame

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Put the lead frame substrate into an alkaline degreasing agent electrolytic solution containing 60g / L of degreasing powder, electrolyze the lead frame substrate at a current density of 5 amperes / dm, and an electrolytic solution temperature of 50°C for 30 seconds, and then clean the lead frame substrate with tap water Blow dry

[0049] Put the above-mentioned lead frame substrate into an acidic oxidizer solution containing 80g / L of open-cylinder salt at room temperature and soak for 20s, then wash the lead frame substrate with tap water, and then rinse and dry with deionized water;

[0050] Put the above-mentioned lead frame matrix into a nickel plating solution containing 50g / L of nickel sulfamate, 55g / L of boric acid, temperature of 50°C, and pH value of 4.5 for electrodeposition at a current density of 5 amperes / dm2 for 60 seconds, Make the thickness of the electroplated nickel layer 0.5-2μm, and then clean the lead frame matrix with deionized water and blow dry;

[0051] P...

Embodiment 2

[0057] Put the lead frame base into an alkaline degreasing agent electrolytic solution containing 70g / L of degreasing powder, electrolyze the lead frame base at a current density of 10 amperes / dm² and an electrolytic solution temperature of 55°C for 25 seconds, and then clean the lead frame base with tap water Blow dry

[0058] Put the above-mentioned lead frame substrate into room temperature acidic oxidizer solution containing 100g / L of open-cylinder salt and soak for 15s, then wash the lead frame substrate with tap water, and then rinse and dry with deionized water;

[0059] Put the above-mentioned lead frame substrate into a nickel plating solution containing 60g / L nickel sulfamate, 45g / L boric acid, a temperature of 55°C, and a pH value of 4.0 for electrodeposition at a current density of 15 amperes / dm2 for 55 seconds, Make the thickness of the electroplated nickel layer 0.5-2μm, and then clean the lead frame matrix with deionized water and blow dry;

[0060] Put the above-ment...

Embodiment 3

[0066] Put the lead frame base into an alkaline degreasing agent electrolytic solution containing 80g / L of degreaser powder, electrolyze the lead frame base at a current density of 25 amperes / dm2 and an electrolytic solution temperature of 60°C for 20 seconds, and then clean the lead frame base with tap water Blow dry

[0067] Put the above-mentioned lead frame substrate into a room temperature acidic oxidant solution containing 120g / L of open-cylinder salt for 10 seconds, then wash the lead frame substrate with tap water, and then rinse with deionized water to dry;

[0068] Put the above-mentioned lead frame substrate into a nickel plating solution containing 70g / L nickel sulfamate, 35g / L boric acid, a temperature of 60°C, and a pH value of 3.5 for electrodeposition at a current density of 25 amperes / dm2 for 50s, Make the thickness of the electroplated nickel layer 0.5-2μm, and then clean the lead frame matrix with deionized water and blow dry;

[0069] Put the above-mentioned lead...

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Abstract

The present invention discloses an ultrathin palladium plating and gold plating process for a lead wire frame. The process comprises the following steps: carrying out electrolysis degreasing, carrying out an activation treatment on a lead wire frame substrate, carrying out electrodeposition of a nickel plating layer, carrying out an activation treatment on the nickel layer, carrying out electrodeposition of a palladium plating thin layer, and carrying out high-frequency pulse electrodeposition of a gold plating thin layer, wherein a palladium-plated lead wire frame substrate is placed into a gold plating liquid to carry out electrodeposition for 10-20 s, cleaned with gold recovery water, dried and is subjected to gold protection to obtain the finished product. According to the present invention, under the premise of ensurence of passing of the test trial, the ultrathin gold-palladium plating layer is formed, wherein a thickness of the electroplated palladium layer is 0.02-0.1 mum, and is far lower than a thickness of 2-5 mum of the electroplated palladium layer in the existing process, and the electroplated gold layer is 0.003-0.01 mum, and is far lower than a thickness of 0.3-1.2 mum of the electroplated gold layer in the existing process, such that excellent performances of the original palladium plating layer and the original gold plating layer are ensured, gold consumption and palladium consumption are reduced, use of noble metals is substantially reduced, metal utilization rate is effectively improved, and cost is saved.

Description

【Technical Field】 [0001] The invention relates to a lead frame electroplating process, in particular to a lead frame ultra-thin palladium plating and gold plating process, belonging to the technical field of integrated circuit chip processing and manufacturing. 【Background technique】 [0002] Gold has extremely high chemical stability, is insoluble in common acids, only soluble in aqua regia, so the gold coating has strong corrosion resistance, good discoloration resistance, good ductility and easy polishing, so it is often used as a decorative coating , Such as plated jewelry, watch parts, artwork, etc. Gold has good electrical conductivity, is easy to solder, and is resistant to high temperatures. The thermal conductivity of gold is 70% of that of silver. Therefore, it is widely used in the electroplating of precision instruments, printed boards, integrated circuits, military electronic tubes, electrical contacts and other parts that require long-term stability of electrical p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/12C25D3/12C25D3/50C25D3/48C25D5/48C25D5/34H01L21/60H01L23/48
CPCH01L2924/0002
Inventor 刘国强
Owner ACKOTEC ZHONGSHAN ELECTRONICS PARTS
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