Preparation method of contact alloy for nano particle filled tungsten skeleton special structure

A nanoparticle and tungsten skeleton technology, applied in the direction of contacts, circuits, electric switches, etc., can solve the problems of low production efficiency, achieve long service life, solve cracks and high loss, and be easy to promote.

Inactive Publication Date: 2012-12-19
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The fifth category of methods is considered the best despite low productivity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Step 1: Add 20 times the weight of alcohol to the tungsten powder with a particle size of 65-75nm, grind it through a high-speed shearing machine for 30 minutes, then remove the alcohol by centrifugal precipitation, put it into an aqueous solution of copper sulfate with a concentration of 0.5mol / L, and at the same time Add surfactant, stir continuously for 20min, then add hydrazine hydrate reducing agent solution with a concentration of 1mol / L and sodium lauryl sulfate dispersant, continue stirring for 30min, wash the powder in the solution with water for 5 times and centrifuge, vacuum degree is 10Pa, the temperature is 60℃, and drying for 30min can obtain copper-coated nano-tungsten particle powder with an average particle size of 110nm;

[0031] Weigh 74.72% of the total mass percentage of coarse tungsten powder with a particle size of ≥20 μm, 5.28% of the total mass percentage of copper-clad tungsten nanopowder with an average particle size of 110nm, and 20% of the to...

Embodiment 2

[0037] The sample shape and size of the electrical contact alloy sheet for the 1000KV ultra-high voltage power grid are square: 20×20mm, and the thickness is 9mm. Its preparation steps are as follows:

[0038] Step 1: Weigh 74.72% of the total mass percentage of coarse tungsten powder with a particle size ≥ 20 μm, 5.28% of the total mass percentage of copper-clad tungsten nanopowder with an average particle size of 110nm, and 20% of the total mass percentage Copper powder, spare;

[0039] Step 2: Mix the coarse tungsten powder with a particle size ≥ 20 μm and the copper-clad tungsten nanopowder with an average particle size of 110 nm prepared in the above steps, and mix them into the ball mill according to the weight ratio of the powder to the stainless steel ball at 1:1. Wet mix with water and ethanol for 1 hour, then dry in a vacuum drying oven at a vacuum degree of 30 Pa and a temperature of 70°C for 1 hour, and set aside;

[0040] Step 3: Add the alcohol-soluble phenolic...

Embodiment 3

[0049] The sample shape and size of the electrical contact alloy sheet for the 1000KV ultra-high voltage power grid are square: 20×20mm, and the thickness is 9mm. Its preparation steps are as follows:

[0050] Step 1: Weigh 74.72% of the total mass percentage of coarse tungsten powder with a particle size ≥ 20 μm, 5.28% of the total mass percentage of copper-clad tungsten nanopowder with an average particle size of 110nm, and 20% of the total mass percentage Copper powder, spare;

[0051] Step 2: Mix the coarse tungsten powder with a particle size ≥ 20 μm and the copper-clad tungsten nanopowder with an average particle size of 110 nm prepared in the above steps evenly, and mix them into a ball mill according to the weight ratio of powder to stainless steel balls at 1:1. 2 hours, then in a vacuum drying oven with a vacuum degree of 25Pa and a temperature of 65°C, dry for 1 hour, and set aside;

[0052] Step 3: Add the alcohol-soluble phenolic resin solution with a concentrati...

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Abstract

The invention belongs to the field of preparation of metal powder and alloy in metal materials and relates to a preparation method of a contact alloy for a nano particle filled tungsten skeleton special structure. The preparation method comprises the steps of preparing nano copper-coated tungsten powder by adopting an aqueous solution reduction method and preparing a base of a nano particle filled tungsten skeleton by carrying out a powder mixing-pressing process on nano tungsten powder. On the basis of more than 50 years of traditional production experience, a novel Cu-W(80) contact alloy for the nano particle filled tungsten skeleton special structure is provided and developed, and the contradiction problem between crack of the alloy and high loss is better solved. Integrated performance of the alloy is obviously improved, the contact alloy produced by adopting the preparation method disclosed by the invention has long service life and stable and reliable performance on an ultrahigh voltage heavy load power network, thus being applicable to being widely popularized and applied; and the contact alloy produced by adopting the preparation method disclosed by the invention has less technical investment, is easy to popularize and is applicable to independent business establishment and transformation of medium-sized and small enterprises.

Description

technical field [0001] The invention belongs to the technical field of preparation of metal powder and alloy in metal materials, and in particular provides a process of preparing copper-coated nano-tungsten powder by using an aqueous solution reduction method and mixing the nano-alloy powder with coarse-grained tungsten powder through pressing and sintering process. It has become a Cu-W (80) electrical contact alloy with a special organizational structure filled with nano-tungsten particles into the gap of the tungsten skeleton. This technology is suitable for electrical contacts with ultra-high voltage (500~1000kv) and super-large load (50~100kA) alloy. [0002] Background technique [0003] Electrical contact alloy is the contact element material of switching electrical appliances. It undertakes the task of connecting and disconnecting the load current, and plays a decisive role in the reliable operation of electrical switches. In recent years, with the rapid development...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/04C22C27/04H01H1/021
Inventor 吴成义郭志猛陈存广王晓佳于潇张稳稳高琳杨芳吕绍元
Owner UNIV OF SCI & TECH BEIJING
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