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Printed circuit forming method

A molding method and circuit printing technology, which is applied to printed circuits, printed circuit manufacturing, conductive pattern formation, etc., can solve the problems of high cost and large amount of precious metal used in circuits, and achieve high production efficiency, clean and environmentally friendly production process, and low consumption Effect

Inactive Publication Date: 2012-12-19
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the circuit formed by silver paste printing has the disadvantages of large amount of precious metals and high cost.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1) Print the target circuit pattern on the double-adhesive paper substrate, the printing method is screen printing, and the printing material is solvent-based printing ink.

[0028] 2) After the printing is completed, sprinkle an excessive amount of silver flakes on the printed pattern, so that the silver flakes can fully cover the printed pattern. The diameter of the silver flakes is 30-50 μm.

[0029] 3) Use a suction fan to suck the excess silver flakes away from the substrate and recycle, then only the silver flakes on the target circuit pattern will be stuck and remain on the substrate to form a silver flake layer.

[0030] 4) Put the substrate into an oven at 60°C to dry for 20 minutes, and take out the substrate after the ink is completely dry.

[0031] 5) Put the substrate into the press for pressurization, the pressure is 0.1MPa, and compact the silver sheet layer.

[0032] 6) Spray a solvent-based acrylate coating as a protective layer on the circuit formed ...

Embodiment 2

[0034] 1) Print the target circuit pattern on the PET film substrate, the printing method is letterpress printing, and the printing material is UV-curable printing ink.

[0035] 2) After the printing is completed, sprinkle an excessive amount of powder mixed with copper flakes and silver nanowires on the printed pattern, with a mass ratio of 1:1, so that the powder can fully cover the printed pattern. The diameter of the copper sheet is 100-200 μm, the diameter of the silver nanowire is 200-300 nm, and the length is 50-80 μm.

[0036] 3) Use a suction fan to suck the excess powder away from the substrate and recycle, then only the powder at the printed pattern is stuck and remains on the substrate.

[0037] 4) Use a UV lamp to irradiate the reverse side of the printing substrate until the ink is completely cured.

[0038] 5) Put the matrix into the press for pressurization, the pressure is 20MPa, and compact the powder.

[0039] 6) Spray UV-curable acrylate coating on the ci...

Embodiment 3

[0041] 1) Print the target circuit pattern on the glass fiber reinforced epoxy resin board substrate, the printing method is pad printing, and the printing material is water-based printing ink.

[0042] 2) After the printing is completed, sprinkle an excessive amount of mixed powder of graphene and carbon nanotubes on the printed pattern, with a mass ratio of 1:1, so that the powder can fully cover the printed pattern. Graphene has a diameter of 10-30 μm, and carbon nanotubes have a diameter of 30-50 nm and a length of 30-40 μm.

[0043] 3) Use a suction fan to suck the excess powder away from the substrate and recycle, then only the powder at the printed pattern is stuck and remains on the substrate.

[0044] 4) Leave the substrate at room temperature for 30 minutes to completely dry the water-based ink.

[0045] 5) Put the matrix into the press for pressurization, the pressure is 30MPa, and compact the powder.

[0046] 6) Brush the silicone coating on the circuit. After th...

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Abstract

The invention relates to a printed circuit forming method which includes steps of printing a target circuit pattern on a substrate through ink; spreading conductive powder onto the target circuit pattern to cover the same completely so as to form a conductive powder layer bonded on the target circuit pattern before the target circuit pattern is dried or cured; removing residual conductive powder on the surface of the substrate by blowing or sucking and recovering the residual conductive powder; drying or curing the ink and the conductive powder layer by heating the substrate or placing the substrate at the normal temperature; pressurizing the substrate on a press to compact the conductive powder layer; and coating a protective layer on the conductive powder layer to obtain a conductive circuit. The printed circuit forming method has the advantages that production process is clean and environment-friendly, cost is low, environment-friendly base materials can be adopted, and the printed circuit forming method is applicable to manufacturing of both rigid circuits and flexible circuits.

Description

Technical field: [0001] The invention relates to a method for forming a circuit, in particular to a method for forming a circuit by using conductive powder after printing graphics. technical background: [0002] Electronic products have penetrated into every aspect of modern life. The consumption of circuit boards, an integral part of electronic products, has also increased dramatically. Circuit boards are divided into rigid circuit boards and flexible circuit boards, which are used according to different applications. At present, the molding method of circuit boards is generally etching molding or silver paste printing molding. The etching molding method is a molding method that prints and develops on the metal-clad plate, and then corrodes the metal outside the pattern with a corrosive solution to form a conductive path. The etching molding method has disadvantages such as the production process is not environmentally friendly, pollution is generated, and the circuit su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12H05K3/18
Inventor 黄贵文付绍云
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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