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High heat dissipation type inductor

A technology with high heat dissipation and inductance, applied in the field of inductance, it can solve the problems of thermal aging, low DC superposition characteristics, overheating use, etc., and achieve the effects of high toughness and bonding strength, excellent DC superposition characteristics, and high heat resistance.

Inactive Publication Date: 2013-01-23
TRIO TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, with the rise of the working temperature, the existing inductance components tend to overheat and affect normal use
In addition, as the overheating phenomenon continues, heat aging is likely to occur and the life is shortened
Under normal circumstances, scrapping will occur after the temperature reaches 100 degrees Celsius
Moreover, its DC superposition characteristic is small, high frequency loss rate is high, which improves energy consumption
Furthermore, when the existing inductance components are used in a humid environment, they are prone to moisture and rust

Method used

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  • High heat dissipation type inductor
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Embodiment Construction

[0014] Such as figure 1 , figure 2 The high heat dissipation inductor shown includes an inductor core body 1 , which is different in that: the inductor core body 1 used in the present invention is provided with an accommodating space 2 . Specifically, a wire pack assembly 3 is provided in the accommodation space 2, and the accommodation space 2 is filled with alloy powder. At the same time, the pins 4 of the wire package assembly 3 and the heat dissipation structure are arranged at the bottom of the inductor core body 1 .

[0015] As far as a preferred embodiment of the present invention is concerned, in order to facilitate effective heat dissipation during work, increase the heat dissipation ratio, and reduce the temperature of the inductor, the heat dissipation structure is a heat dissipation groove 5 . At the same time, in consideration of unnecessary obstruction to the cooling slot 5 after the inductor is installed in place, there are cooling bumps 6 distributed at the ...

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Abstract

The invention relates to a high heat dissipation type inductor which comprises an inductor iron core body, and is characterized in that an accommodating space is arranged in the inductor iron core body; a coil component is arranged in the accommodating space, and the accommodating space is filled with alloy powder; coil component pins are arranged at the bottom of the inductor iron core body; and meanwhile heat dissipation structures are distributed at the bottom of the inductor iron core body. By adopting the high heat dissipation type inductor provided by the invention, the problem of thermal aging at the time of working at high temperature is effectively avoided; at the same time due to the excellent direct current superposing characteristic of the high heat dissipation type inductor, high frequency and low loss can be achieved; with respect to the physical characteristic, the inductor has extremely high tenacity and bonding strength; and meanwhile, the inductor has flowery appearance and is rustless.

Description

technical field [0001] The invention relates to an inductor, in particular to a high heat dissipation inductor. Background technique [0002] Inductor is an important component in the circuit, which can achieve the functions of filtering, energy storage, matching and resonance. With the miniaturization, portability and high-density assembly of electronic products, inductive components have developed rapidly, and under the consideration of electromagnetic compatibility, the elimination of electromagnetic interference of electronic products has become a basic requirement for electronic products. Many countries have stipulated Restricted by laws and regulations, only in compliance with the regulations can they be sold, and more emphasis is placed on the demand and application of inductance. [0003] However, with the increase of working temperature, the existing inductance components tend to be overheated and affect normal use. In addition, as the overheating phenomenon conti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F17/04H01F27/08
Inventor 林伙利陈洪生
Owner TRIO TECH SUZHOU
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