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Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device

A technology of electronic devices and copper alloys, applied in the manufacture of cables/conductors, conductive materials, conductive materials, etc., can solve the problems of high tensile elastic modulus, severe contact pressure changes, plastic deformation, etc., to achieve high conductivity, high Yield Strength, Effect of Low Tensile Modulus of Elasticity

Active Publication Date: 2013-01-23
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, in the Corson copper-nickel-silicon alloy disclosed in Patent Document 2, the tensile elastic modulus is 125 to 135 GPa, which is relatively high.
Among them, in a connector with a structure in which the tab is inserted by pressing the female spring contact part, if the tensile elastic modulus of the material constituting the connector is high, the contact pressure at the time of insertion fluctuates drastically, and it is easy to exceed the elastic limit. However, there is a possibility of plastic deformation, so it is not preferred
[0013] In addition, in the Cu-Mg-P alloy described in Patent Document 3, although the electrical conductivity is high, mechanical properties such as yield strength and tensile strength are insufficient.
Also, since the tensile modulus of elasticity is high, there is a problem that it is not suitable for connectors, etc.

Method used

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  • Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
  • Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
  • Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device

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Embodiment

[0106] Hereinafter, the results of confirmation experiments conducted to confirm the effects of the present invention will be described.

[0107] A copper raw material consisting of oxygen-free copper (ASTM B152 C10100) with a purity of 99.99% by mass or higher is prepared, and the copper raw material is placed in a high-purity graphite crucible, and high-frequency melting is performed in an atmosphere furnace set to an Ar gas atmosphere. Various additive elements were added to the obtained copper molten metal to prepare the composition shown in Table 1 and Table 2, and this was poured into a carbon mold to produce an ingot. In addition, the size of the ingot was about 20 mm in thickness x about 20 mm in width x about 100 to 120 mm in length. In addition, the remainder of the component compositions shown in Table 1 and Table 2 are copper and unavoidable impurities.

[0108] In an Ar gas atmosphere, the obtained ingot was subjected to a heating step of heating under the temper...

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Abstract

A copper alloy for electronic device according to the present invention contains 2.6 at % - 9.8 at % of Mg and 0.1 at %- 20 at % of Al, and a balance of inevitable impurities.

Description

technical field [0001] The present invention relates to a copper alloy for electronic devices suitable for electrical and electronic components such as terminals, connectors or relays, a method for manufacturing the copper alloy for electronic devices, and a copper alloy rolled material for electronic devices. [0002] This application claims priority based on Japanese Patent Application No. 2010-112267 for which it applied on May 14, 2010, and uses the content in this specification. Background technique [0003] Conventionally, along with miniaturization of electronic devices, electrical devices, etc., electrical and electronic components such as terminals, connectors, and relays used in these electronic devices, electrical devices, and the like have been required to be miniaturized and thinned. For this reason, copper alloys with excellent elasticity, strength, and electrical conductivity are required as materials constituting electrical and electronic components. In part...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C9/02C22C9/04C22C9/05C22C9/06C22C9/10C22F1/08H01B1/02H01B5/02H01B13/00H01R13/03C22F1/00C22F1/02C22C9/01
CPCC22C9/00H01B1/026H01R13/03C22C1/02C22C9/01C22F1/08C22C9/04H01B1/02
Inventor 伊藤优树牧一诚
Owner MITSUBISHI MATERIALS CORP
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