1050 alloy CTO (computer-to-plate) substrate and preparation method thereof

Abstract

The invention provides a 1050 alloy CTO (computer-to-plate) substrate which comprises the following components in percentage by mass: 0.28-0.32% of Fe, 0.08-0.12% of Si, at most 0.03% of Ti, at most 0.02% of Cu, at most 0.02% of Mn, at most 0.02% of Mg, at most 0.02% of Zn, at most 0.02% of V and the balance of Al. The invention also provides a preparation method of the 1050 alloy CTP substrate. A piezoelectric template control technique, a normal-temperature high-speed multichannel cast-rolling technique, a furnace-out Al-5Ti-B wire matching supersonic grain refinement technique and a continuous rolling technique are utilized to prepare the original cast-rolling structure with abundant uniform and fine crystal grains and dispersedly distributed diphase compounds at the grain boundary, and a processing structure with flat template quality and uniform deformation.

Description

(1) Technical field

[0001] The invention belongs to the technical field of aluminum sheet and foil processing, and in particular relates to a CTP plate base material and a preparation method thereof. (2) Background technology

[0002] The CTP plate is composed of a plate base and a photosensitive layer. The CTP plate is exposed by focusing the laser on the photosensitive layer on the surface of the CTP plate. The microscopic uniformity of the photosensitive layer directly affects the ink balance in the printing process. The microscopic uniformity of the photosensitive layer is related to the shape and uniformity of the electrolytic grains of the CTP plate base material. The key technology for the CTP plate base material to obtain fine and uniform electrolytic grains lies in how to obtain the apparent profile Ra through intergranular corrosion during the electrolysis process. ≤0.55μm, microscopic unevenness Rz≤3.5μm uniform size of the etch pit, which is related to whether th...