1050 alloy CTO (computer-to-plate) substrate and preparation method thereof

A technology of alloy and base material, which is applied in the field of CTP plate base material and its preparation, can solve the problems of high cost, insufficient photosensitive layer micro-uniformity and printing durability, complex production process, etc., and achieve low production cost and low floor space The effect of small size and short process flow

Active Publication Date: 2013-02-06
浙江中金铝业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its production process is complicated, the cost is high, and the microscopic uniformity and printing durability of the photosensitive layer of the CTP plate are still insufficient.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Embodiment 1: A 1050 alloy CTP plate substrate, expressed in mass percentage, contains 0.28% iron Fe, 0.08% silicon Si, 0.03% titanium Ti, 0.02% copper Cu, 0.02% manganese Mn, Magnesium Mg0.02%, zinc Zn0.02%, vanadium V0.02%, and the balance is Al.

[0043] A kind of preparation method of 1050 alloy CTP plate base material, its specific production process is as follows:

[0044] a. Melting

[0045] Add the charge prepared according to the proportion into the flame reverberatory furnace. When batching, you can approach the insufficient amount, so that you can adjust the composition through the subsequent addition of materials, heat, melt and heat up. Stir, slag, and sample when the temperature reaches 730 ° C. Analysis, composition adjustment, stirring, sampling analysis, refining of high-purity nitrogen with a mass percentage of 99.995% after the composition is qualified, slag removal, and temperature adjustment to obtain an aluminum alloy melt;

[0046] b. Refining ...

Embodiment 2

[0068] Embodiment 2: A 1050 alloy CTP plate substrate, expressed in mass percentage, contains iron Fe0.32%, silicon Si0.12%, titanium Ti0.02%, copper Cu0.01%, manganese Mn0.01%, Magnesium Mg 0.01%, zinc Zn 0.01%, vanadium V 0.01%, and the balance is Al.

[0069] A kind of preparation method of 1050 alloy CTP plate base material, its specific production process is as follows:

[0070] a. Melting

[0071] Put the burden prepared according to the above ratio into the flame reverberatory furnace, heat to melt and heat up, when the temperature reaches 745°C, carry out stirring, slag removal, sampling analysis, composition adjustment, stirring, sampling analysis, and the mass percentage after the composition is qualified is 99.995% high-purity nitrogen refining, slag removal, temperature adjustment to obtain aluminum alloy melt;

[0072] b. Refining

[0073] The aluminum alloy melt is transferred to a static furnace for 10 minutes and then refined. The refining time is 22 minutes...

Embodiment 3

[0095] A 1050 alloy CTP plate base material, expressed in mass percentage, contains iron Fe0.30%, silicon Si0.10%, titanium Ti0.03%, copper Cu0.02%, manganese Mn0.02%, magnesium Mg0.02 %, zinc Zn0.02%, vanadium V0.02%, and the balance is Al.

[0096] A kind of preparation method of 1050 alloy CTP plate base material, its specific production process is as follows:

[0097] a. Melting

[0098] Add the charge prepared according to the above-mentioned ratio into the flame reverberatory furnace, heat to melt and heat up, and when the temperature reaches 755°C, carry out stirring, slag removal, sampling analysis, composition adjustment, stirring, sampling analysis, and the mass percentage after the composition is qualified is 99.995% high-purity nitrogen refining, slag removal, temperature adjustment to obtain aluminum alloy melt;

[0099] b. Refining

[0100] Transfer the aluminum alloy melt to the static furnace for 10 minutes and then refine it. The refining time is 25 minutes...

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PUM

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Abstract

The invention provides a 1050 alloy CTO (computer-to-plate) substrate which comprises the following components in percentage by mass: 0.28-0.32% of Fe, 0.08-0.12% of Si, at most 0.03% of Ti, at most 0.02% of Cu, at most 0.02% of Mn, at most 0.02% of Mg, at most 0.02% of Zn, at most 0.02% of V and the balance of Al. The invention also provides a preparation method of the 1050 alloy CTP substrate. A piezoelectric template control technique, a normal-temperature high-speed multichannel cast-rolling technique, a furnace-out Al-5Ti-B wire matching supersonic grain refinement technique and a continuous rolling technique are utilized to prepare the original cast-rolling structure with abundant uniform and fine crystal grains and dispersedly distributed diphase compounds at the grain boundary, and a processing structure with flat template quality and uniform deformation.

Description

(1) Technical field [0001] The invention belongs to the technical field of aluminum sheet and foil processing, and in particular relates to a CTP plate base material and a preparation method thereof. (2) Background technology [0002] The CTP plate is composed of a plate base and a photosensitive layer. The CTP plate is exposed by focusing the laser on the photosensitive layer on the surface of the CTP plate. The microscopic uniformity of the photosensitive layer directly affects the ink balance in the printing process. The microscopic uniformity of the photosensitive layer is related to the shape and uniformity of the electrolytic grains of the CTP plate base material. The key technology for the CTP plate base material to obtain fine and uniform electrolytic grains lies in how to obtain the apparent profile Ra through intergranular corrosion during the electrolysis process. ≤0.55μm, microscopic unevenness Rz≤3.5μm uniform size of the etch pit, which is related to whether th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/00C22C1/02C22C1/06C22B9/05C22B9/02B21B1/46B21B1/22B21B1/40C21D8/02C22F1/04
Inventor 丁戎江
Owner 浙江中金铝业有限公司
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