Bonding method for improving bonding force and optical properties of bonding crystal
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING UNIV OF TECH
- Publication Date
- 2013-02-06
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a bonding method for improving the bonding force and optical properties of bonded crystals, which can be used to prepare quasi-phase-matched nonlinear crystals and belongs to the field of nonlinear optical crystals. Background technique
[0002] Wafer bonding technology is to clean and activate two homogeneous or heterogeneous materials with clean surface and atomic level roughness, without using any adhesive substances, and directly bond them into one under certain conditions. Forces, molecular forces, and even atomic forces combine together. Wafer bonding technology has great advantages. The interface obtained by this technology has the advantages of firmness, smoothness and optical transparency. This interface is of great significance for the innovation of optical devices. Quasi-phase matching is an effective optical nonlinear frequency conversion method developed in recent years. The polarization direction inside the quasi...