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Method for manufacturing polytetrafluoroethylene high-frequency circuit board

A high-frequency circuit board, polytetrafluoroethylene technology, applied in the direction of printed circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of increasing production costs and man-hours, difficulty in one-time production of solder mask, etc., to improve product quality and The effect of work efficiency, high precision and stable performance

Inactive Publication Date: 2013-02-06
蔡新民
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

However, due to the particularity of the material of the polytetrafluoroethylene circuit board, it is difficult to make the solder mask at one time; and the solder mask of the public PTFE high-frequency board is made twice, which increases the production cost and man-hours.

Method used

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  • Method for manufacturing polytetrafluoroethylene high-frequency circuit board

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Embodiment Construction

[0009] exist figure 1 Among them, the present invention is a method for manufacturing a polytetrafluoroethylene high-frequency circuit board, which includes the following steps: Step 1: Carry out engineering and photo-painting data production: first, carry out graphic design on the template, and use the designed graphics according to the production process Parameters are used to process engineering documents, and then according to the production conditions, the processed documents are made up, and a high-precision laser photoplotter with a resolution of 20240dpi is used to make black negatives, and the photopainted negatives are washed, developed, fixed, cleaned, Air-dry; then check the finished negative, and finally use the checked negative as the master to copy the diazo film with a 5KW exposure machine, and check the copied diazo film; Step 2: cutting and drilling 1. Production of hole metallization: First, use an electric shearing machine to cut out the PTFE copper-clad la...

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Abstract

The invention discloses a method for manufacturing a polytetrafluoroethylene high-frequency circuit board. The method comprises the following steps of: 1, manufacturing engineering and light painting materials; 2, cutting the materials, drilling holes and metalizing the holes; 3, making surface patterns; 4, electroplating and etching; 5, carrying out solder mask and surface solderability treatment; and 6, molding. The method for manufacturing the polytetrafluoroethylene high-frequency circuit board, provided by the invention, has the advantages that not only is the manufacturing precision high and are product quality and working efficiency improved effectively, but also the manufactured high-frequency circuit board is stable in performance.

Description

technical field [0001] The invention relates to a manufacturing method of a polytetrafluoroethylene high-frequency circuit board. Background technique [0002] In addition to the excellent high heat resistance, high heat dissipation, and excellent dimensional stability of ordinary circuit boards, high-frequency circuit boards also have high frequency, and the insulating dielectric layer has good strength and flexibility. With the development of electronic products in the direction of miniaturization, digitalization, high frequency, and high reliability, the wiring density of high-frequency circuit boards is also increasing day by day. It is also an inevitable trend. However, due to the particularity of the material of the polytetrafluoroethylene circuit board, it is difficult to manufacture the solder mask at one time; and the solder mask of the disclosed polytetrafluoroethylene high-frequency board is made twice, which increases the production cost and man-hours. In order...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 蔡新民
Owner 蔡新民
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