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Solar crystalline silicon wafer temporary adhesive and its preparation method

A technology of solar crystal silicon and temporary bonding, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of low bonding strength and difficult degumming, and achieve the effect of shortening the time for smooth degumming

Inactive Publication Date: 2014-05-14
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of low bonding strength and difficult degumming existing in the temporary bonding glue for crystal silicon slices in the prior art, the present invention provides a temporary bonding glue for solar crystal silicon slices, which has good stick strength, flexibility and Hydrophilic performance, which greatly improves the performance of slice glue

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Accurately weigh the following raw materials: 67 parts of bisphenol A epoxy resin, 10 parts of core-shell toughened epoxy resin MX125 resin, 10 parts of heavy calcium carbonate, 10 parts of light calcium carbonate, and hydrophilic gas phase dioxide 5 parts of silicon, add the above-mentioned raw materials into the double planetary power mixing mixer in turn, vacuum to -0.1MPa, and mechanically stir for 2 hours under the conditions of rotation speed of 1000 revolutions / min and revolution speed of 8 revolutions / min. Evenly, the A component of the temporary adhesive glue for solar crystalline silicon slices of the present invention is obtained, and the package is placed for use;

[0024] Accurately weigh the components of the curing agent as follows: 80 parts of polythiol curing agent capcure3800, 10 parts of N-aminoethylpiperazine, 24 parts of calcium carbonate, 5 parts of PVP K30, and add the above-mentioned raw materials to the dual planetary power mixing mixer. Inside, va...

Embodiment 2

[0026] Accurately weigh the following raw materials: 50 parts of bisphenol A epoxy resin, 2 parts of core-shell toughened epoxy resin MX125 resin, 10 parts of light calcium carbonate, and 1 part of hydrophilic fumed silica. The raw materials are sequentially added into the dual planetary power mixing mixer, evacuated to -0.1MPa, and mechanically stirred for 2 hours under the conditions of rotation speed of 1000 revolutions / minute and revolution speed of 8 revolutions / minute, and the solar crystal of the present invention is obtained. The A component of the silicon chip temporary bonding glue, packaged and placed for use;

[0027] Accurately weigh the components of the curing agent as follows: 50 parts of polythiol curing agent capcure3800, 5 parts of N-aminoethylpiperazine, 10 parts of light calcium carbonate, 0.5 parts of PVP K30, and add the above-mentioned raw materials to Double Planet Power in turn In the mixing mixer, vacuumize to -0.1MPa, mechanically stir for 2 hours unde...

Embodiment 3

[0029] Accurately weigh the following raw materials: 59 parts of bisphenol A epoxy resin, 5 parts of core-shell toughened epoxy resin 861340 resin, 5 parts of heavy calcium carbonate, 7 parts of light calcium carbonate, hydrophilic gas phase dioxide 2.5 parts of silicon, add the above-mentioned raw materials into the double planetary power mixing mixer in turn, vacuum to -0.1MPa, and mechanically stir for 2 hours under the conditions of rotation speed of 1000 revolutions / min and revolution speed of 8 revolutions / min. Evenly, the A component of the temporary adhesive glue for solar crystalline silicon slices of the present invention is obtained, and the package is placed for use;

[0030] Accurately weigh the components of the curing agent as follows: 65 parts of polythiol curing agent capcure3800, DMP-307.5 parts, 15 parts of heavy calcium carbonate, 2.5 parts of PVP K30, and add the above-mentioned raw materials to the dual planetary power mixing mixer in turn, pump Vacuum to -0...

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PUM

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Abstract

The invention relates to a solar crystalline silicon wafer temporary adhesive. The solar crystalline silicon wafer temporary adhesive is composed of a component A and a component b with the weight ratio of the component A to the component B being 1:1, wherein the component A is composed of 50-68 parts by weight of an epoxy resin, 1-10 parts by weight of a toughened epoxy resin, 10-25 parts by weight of a filler and 0.5-5 parts by weight of a thixotropic agent; and the component B is composed of 50-80 parts by weight of a curing agent, 5-10 parts by weight of a catalyst, 0.5-5 parts by weight of a cationic surfactant and 10-25 parts by weight of the filler. The preparation method of the solar crystalline silicon wafer temporary adhesive comprises the following steps: respectively preparing the component A and the component B, and mixing the component A with the component B according to the weight ratio of 1:1 when the adhesive is used. The solar crystalline silicon wafer temporary adhesive can obviously shorten the smooth degumming time after the completion of the wafer cutting on the premise that an enough strength is guaranteed in the wafer cutting process to avoid discontinuousness.

Description

Technical field [0001] The invention relates to a temporary adhesive glue for solar crystalline silicon slices and a preparation method thereof. Background technique [0002] In recent years, under the stimulation of the national policy of new energy and new materials, the photovoltaic industry has developed rapidly. According to reports, as of 2010, the installed capacity of solar cells reached 600-1000MW. The production process of solar cells in the photovoltaic industry is generally: ingot casting→square cutting→slicing→module→assembly. [0003] Temporary bonding of crystalline silicon slices generally uses two-component epoxy resin glue, which has certain application process requirements. On the one hand, in order to ensure a normal production rhythm, the total time for bonding to curing and then cutting on the machine should not be longer than 6-8 hours. This requires that the temporary adhesive for crystalline silicon slices should have the characteristics of rapid curing; ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/08H01L31/18H01L21/683
Inventor 许愿王建斌解海华
Owner YANTAI DARBOND TECH