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Preparation method of phenolic resin for refractory material

A technology of phenolic resin and refractory materials, applied in the field of phenolic resin, can solve the problems of poor stability of phenolic resin, low carbon residue, increased cost, etc., achieve high stability, increase carbon residue, and stable structure

Inactive Publication Date: 2013-02-27
SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

The phenolic resin prepared in the prior art has only 40% carbon residue at 800°C, which makes the stability of the phenolic resin poor. The refractory bricks bonded with phenolic resin can only be used for about 3 months, and then the refractory bricks need to be replaced. replaced, thereby increasing the cost of production
Therefore, existing phenolic resin makes the stability of phenolic resin poor due to the low amount of carbon residue

Method used

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  • Preparation method of phenolic resin for refractory material
  • Preparation method of phenolic resin for refractory material

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preparation example Construction

[0019] The embodiment of the present invention discloses a preparation method of phenolic resin for refractory materials, comprising:

[0020] Under the action of the basic catalyst, the phenolic compound, the aldehyde compound and o-phenylphenol are polycondensed to obtain the phenolic resin.

[0021] The present invention synthesizes a phenolic resin containing an aromatic ring by introducing o-phenylphenol into the phenolic resin. Due to the introduction of the aromatic ring, the carbon content of the phenolic resin is increased, and the bond energy of the aromatic ring is higher , The structure is stable, and it is not easy to break during ablation, which increases the amount of carbon residue in the phenolic resin system, so that the phenolic resin has higher stability. On the other hand, since the phenolic hydroxyl group is surrounded by aromatic heterocycles, its water resistance and alkali resistance are greatly improved.

[0022] Since what the present invention prep...

Embodiment 1

[0029] Mix phenol, formaldehyde, and o-phenylphenol at a molar ratio of 1:1.0:0.1, then add ammonia water, stir, and raise the temperature to 60°C at the same time, keep the temperature within this temperature range for 4 hours, and vacuum dehydrate until the water is 5%; add ethylene glycol Alcohol adjusts the viscosity to 3000cp / 25°C.

Embodiment 2

[0031] Mix phenol, formaldehyde, and o-phenylphenol at a molar ratio of 1:1.3:0.5, then add sodium hydroxide, stir, and raise the temperature to 70°C at the same time, keep the temperature within this temperature range for 3 hours, and vacuum dehydrate until the moisture is 6%; add Diethylene glycol adjusts the viscosity to 5000cp / 25°C.

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Abstract

The invention provides a preparation method of phenolic resin for a refractory material. The method is as below: phenolic compounds, aldehyde compounds and o-phenylphenol are subjected to a polycondensation reaction under the action of an alkaline catalyst to obtain the phenolic resin. Through the polycondensation reaction of phenolic compounds, aldehyde compounds and o-phenylphenol, the o-phenylphenol is introduced into the phenolic resin; as aromatic ring is introduced into the phenolic resin, the phenolic resin gains increased carbon content; besides, the aromatic ring has high bond energy and stable structure, and is not easily broken for ablation under high temperature, so that the phenolic resin gains increased residual carbon content and high stability. The experiment results show that the phenolic resin prepared by the invention has residual carbon content of 48wt%-52.5wt%.

Description

technical field [0001] The invention relates to the technical field of phenolic resins, in particular to a preparation method of phenolic resins for refractory materials. Background technique [0002] Phenolic resin is the earliest industrialized synthetic resin in the world, and it is also one of the three major thermosetting resins. Due to the rich source of raw materials, simple synthesis process, low cost, good chemical properties, physical properties, mechanical properties and electrical insulation properties of phenolic resin, it has been widely used in various fields, such as paints, adhesives, coatings, molds, etc. Plastics, laminated materials, foamed plastics, anti-corrosion mastics and ion exchange membranes have been used on a large scale in the transportation, construction, military and electrical industries. On the other hand, because phenolic resin also has the characteristics of heating and curing, strong cohesive force after curing, high mechanical strength...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/24
Inventor 江成真胡伟李枝芳魏务翠
Owner SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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