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Heat-curing heat-conduction heat-dissipation paint and preparation method thereof

A heat-dissipating coating and heat-curing technology, applied in coating and other directions, can solve problems such as energy consumption and environmental pollution, and achieve the effects of production cost control, good flame retardant insulation, and excellent corrosion resistance.

Inactive Publication Date: 2013-03-13
JIANG SU YOUNG KING ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problems of energy consumption and environmental pollution caused by the existing solvent-based heat-conducting and heat-dissipating coatings, the film-forming and curing time usually takes about one hour, and the curing temperature needs to reach 150 degrees Celsius. The present invention provides a heat-curing heat-conducting and heat-dissipating coating and its preparation method. Especially suitable for high power density electronic industrial device manufacturing, it can be cured at a temperature of 70 degrees Celsius, and the heat dissipation effect of the coating is obvious

Method used

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  • Heat-curing heat-conduction heat-dissipation paint and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Take 30% of acrylic resin, 30% of nitrocellulose resin, 15% of solvent, 2% of auxiliary agent, 3% of dyeing agent, 20% of copper powder, and the average particle size of copper powder is 1 micron.

[0023] The solvent components are butyl acetate, n-butanol and ethyl cellosolve, and the mass ratio of the components in the mixed solvent is 2:2:1.

[0024] The auxiliary agent includes a defoamer and a leveling agent, the mass ratio of the defoamer and the leveling agent is 1:1, wherein the defoamer is a silicone defoamer, and the leveling agent is an organic fluorine leveling agent.

[0025] Mix all butyl acetate, n-butanol and ethyl cellosolve evenly, and dissolve all acrylic resin and nitrocellulose resin in the above mixed solvent to form a resin solution. Take all the resin solution in the above steps, mix it with the dyeing agent, and stir it evenly at room temperature at 800-1000 rpm to form a paint; pour the paint in the above steps into a sand mill to grind a...

Embodiment 2

[0028] Prepare 30% of acrylic resin, 30% of nitrocellulose resin, 15% of solvent, 2% of additives, 3% of carbon black, 20% of boron nitride, and the average particle size of boron nitride is 3 microns.

[0029] The solvent is butyl acetate, n-butanol, and ethyl cellosolve, and the mass-to-component ratio is 2:2:1.

[0030] The auxiliary agent includes a defoamer and a leveling agent, the mass ratio of the defoamer and the leveling agent is 1:1, wherein the defoamer is a silicone defoamer, and the leveling agent is an organic fluorine leveling agent.

[0031] Mix all butyl acetate, n-butanol and ethyl cellosolve evenly, and dissolve all acrylic resin and nitrocellulose resin in the above mixed solvent to form a resin solution. Take all the resin solution in the above steps, mix it with the dyeing agent, and stir it evenly at room temperature at 800-1000 rpm to form a paint; pour the paint in the above steps into a sand mill to grind and disperse until the fineness reaches 5 mi...

Embodiment 3

[0034] Prepare 30% of acrylic resin, 30% of nitrocellulose resin, 15% of solvent, 2% of additives, 3% of carbon black, 20% of aluminum nitride, and the average particle size of aluminum nitride is 3 microns.

[0035] The solvent is butyl acetate, n-butanol, and ethyl cellosolve, and the mass-to-component ratio is 2:2:1.

[0036] The auxiliary agent includes a defoamer and a leveling agent, the mass ratio of the defoamer and the leveling agent is 1:1, wherein the defoamer is a silicone defoamer, and the leveling agent is an organic fluorine leveling agent.

[0037] Mix all butyl acetate, n-butanol and ethyl cellosolve evenly, and dissolve all acrylic resin and nitrocellulose resin in the above mixed solvent to form a resin solution. Take all the resin solution in the above steps, mix it with the dyeing agent, and stir it evenly at room temperature at 800-1000 rpm to form a paint; pour the paint in the above steps into a sand mill to grind and disperse until the fineness reaches...

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Abstract

The invention discloses heat-curing heat-conduction heat-dissipation paint and a preparation method thereof, belonging to the field of heat dissipation paint. The paint comprises the components by weight percent: 25-30% of acrylic acid resin, 25-30% of nitro-cotton resin, 15-20% of solvent, 2-4% of auxiliary agent, 2-3% of coloring agent and 20-30% of inorganic filler, wherein the solvent comprises the components: butyl acetate, n-butyl alcohol and ethyl cellosolve according to the mass ratio of 2: 2: 1. The preparation method comprises the steps of: evenly mixing the butyl acetate, the n-butyl alcohol and the ethyl cellosolve; dissolving all the acrylic acid resin and nitro-cotton resin into the mixed solvent, and mixing the mixture with the coloring agent; evenly stirring at room temperature to form paint vehicle; and grinding, dispersing, adding the inorganic filler into the paint vehicle, evenly stirring and stabilizing to obtain the target paint. The heat-curing heat-conduction heat-dissipation paint has excellent flame retardant performance, insulation property, high temperature resistance and corrosion resistance, so that the heat-conduction heat-dissipation effects of the coating using the heat-curing heat-conduction heat-dissipation paint are obviously improved compared with the common coating.

Description

technical field [0001] The invention relates to a heat-conducting and heat-dissipating coating and a preparation method thereof, more specifically, to a heat-curing heat-conducting and heat-dissipating coating and a preparation method thereof. Background technique [0002] Domestic high-power-density electronic industrial devices are developing toward miniaturization, compact structure, and multi-function. The resulting heat conduction and heat dissipation problems have seriously affected the stability and reliability of high-power electronic devices. At present, the thermal controls used in electronic devices generally use metal materials, but such materials are heavy in weight and have a large thermal expansion coefficient, which greatly limits their wide use as packaging heat dissipation materials. Therefore, the research and development of new materials that are thinner, lighter in weight, and higher in thermal conductivity are of great significance for realizing lightwe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D133/00C09D101/18C09D7/12
Inventor 游建章
Owner JIANG SU YOUNG KING ELECTRONICS
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