Thermosetting heat conduction and radiation coating and preparation method thereof

Abstract

The invention discloses a thermosetting heat-conducting and heat-dissipating paint and a preparation method thereof, belonging to the field of paint preparation. Heat-curing heat-conducting and heat-dissipating coatings, including polyethylene terephthalate, melamine formaldehyde resin, mixed xylene, dimethyl mixed diacid, colorants and inorganic fillers, the weight ratio is as follows: polyethylene terephthalate 25-35 parts of glycol ester, 5-10 parts of melamine formaldehyde resin, 15-25 parts of mixed xylene, 5-15 parts of dimethyl mixed diacid, 1-5 parts of dyeing agent, 20-30 parts of inorganic filler. The steps of the preparation method are as follows: configure the distribution ratio of each component, mix all mixed xylene and dimethyl mixed diacid evenly, dissolve all polyethylene terephthalate and melamine formaldehyde resin in the above mixed solvent, and form The resin solution is mixed with the dyeing agent and stirred evenly to form a paint, which is poured into a sand mill to grind and disperse until the fineness reaches 5 microns, then add inorganic fillers, stir evenly and stabilize, and then the target paint can be obtained. The heat conduction and heat dissipation effect of the coating of the invention is obviously enhanced compared with the common coating, and the production cost is reduced.

Description

technical field [0001] The invention relates to a heat-conducting and heat-dissipating paint and a preparation method thereof, more specifically a heat-curing heat-conducting and heat-dissipating paint and a preparation method thereof. Background technique [0002] Domestic high-power-density electronic industrial devices are developing toward miniaturization, compact structure, and multi-function. The resulting heat conduction and heat dissipation problems have seriously affected the stability and reliability of high-power electronic devices. At present, the thermal controls used in electronic devices generally use metal materials, but such materials are heavy in weight and have a large thermal expansion coefficient, which greatly limits their wide use as packaging heat dissipation materials. Therefore, the research and development of new materials that are thinner, lighter in weight, and higher in thermal conductivity are of great significance for realizing lightweight and...

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problems of energy consumption and environmental pollution caused by the existing solvent-based heat-conducting and heat-dissipating coatings, the film-forming and curing time usually takes about one hour, and the curing temperature needs to reach 150 degrees Celsius. The present invention provides a heat-curing heat-conducting and heat-dissipating coating and its preparation method. Especially suitable for high power density electronic industrial device manufacturing, it can be cured at a temperature of 130 degrees Celsius, and the heat dissipation effect of the coating is obvious