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Thermosetting heat conduction and radiation coating and preparation method thereof

A heat-dissipating coating and heat-curing technology, applied in polyester coatings, coatings, etc., can solve problems such as energy consumption and environmental pollution, and achieve the effects of controlling production costs, increasing surface hardness, and improving production efficiency

Inactive Publication Date: 2012-10-24
JIANG SU YOUNG KING ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problems of energy consumption and environmental pollution caused by the existing solvent-based heat-conducting and heat-dissipating coatings, the film-forming and curing time usually takes about one hour, and the curing temperature needs to reach 150 degrees Celsius. The present invention provides a heat-curing heat-conducting and heat-dissipating coating and its preparation method. Especially suitable for high power density electronic industrial device manufacturing, it can be cured at a temperature of 130 degrees Celsius, and the heat dissipation effect of the coating is obvious

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Prepare 35 parts of polyethylene terephthalate, 10 parts of melamine formaldehyde resin, 25 parts of mixed xylene, 15 parts of dimethyl mixed diacid, 1 part of dyeing agent, and 20 parts of boron nitride. Mix toluene and dimethyl mixed diacid evenly, dissolve all the polyethylene terephthalate and melamine formaldehyde resin in the above mixed solvent to form a resin solution; take all the quality of the resin solution in the above steps, and mix with the dye Mix and stir evenly at room temperature at 800-1000 rpm to form a paint; pour the paint in the above steps into a sand mill to grind and disperse until the fineness reaches 5 microns, then add all boron nitride and boron nitride The particle size is 1 micron. After stirring evenly and stably under the condition of 800-1000 rpm at room temperature, the target coating can be obtained.

[0022] Use a constant temperature heater and attach it with a thermocouple wire (Thermocouple) to measure the temperature of the tes...

Embodiment 2

[0024] Prepare 35 parts of polyethylene terephthalate, 10 parts of melamine formaldehyde resin, 25 parts of mixed xylene, 15 parts of dimethyl mixed diacid, 1 part of dyeing agent, and 20 parts of aluminum nitride. Mix toluene and dimethyl mixed diacid evenly, dissolve all the polyethylene terephthalate and melamine formaldehyde resin in the above mixed solvent to form a resin solution; take all the quality of the resin solution in the above steps, and mix with the dye Mix and stir evenly at room temperature at 800-1000 rpm to form a paint; pour the paint in the above steps into a sand mill to grind and disperse until the fineness reaches 5 microns, then add all the aluminum nitride and aluminum nitride The particle size is 3 microns. After stirring evenly and stably under the condition of 800-1000 rpm at normal temperature, the target coating can be obtained.

[0025] Use a constant temperature heater and attach it with a thermocouple wire (Thermocouple) to measure the temper...

Embodiment 3

[0027] Prepare 25 parts of polyethylene terephthalate, 5 parts of melamine formaldehyde resin, 15 parts of mixed xylene, 15 parts of dimethyl mixed diacid, 3 parts of dyeing agent, 20 parts of boron nitride, and 10 parts of aluminum oxide , mix all mixed xylene and dimethyl mixed diacid evenly, dissolve all polyethylene terephthalate and melamine formaldehyde resin in the above mixed solvent to form a resin solution; take all the quality resin in the above steps Solution, mixed with all the dyeing agents, stirred evenly at room temperature at 800-1000 rpm to form a paint; pour the paint in the above steps into a sand mill to grind and disperse until the fineness reaches 5 microns, and then add all nitrogen Boron oxide and aluminum oxide, boron nitride and aluminum oxide particle size is 2 microns, after stirring uniformly and stably under the condition of 800-1000 rpm at normal temperature, the target paint can be obtained.

[0028] Use a constant temperature heater and attach...

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Abstract

The invention discloses a thermosetting heat conduction and radiation coating and a preparation method of the coating, belonging to the field of coating preparation. The thermosetting heat conduction and radiation coating comprises the following components by weight: 25-35 parts of polyethylene glycol terephthalate, 5-10 parts of melamino-formaldehyde resin, 15-25 parts of mixed xylene, 5-15 parts of dibasic ester, 1-5 parts of coloring agent and 20-30 parts of inorganic filler. The preparation method comprises the following steps: preparing the components by weight, uniformly mixing all of the mixed xylenes and the dibasic esters, dissolving all of the polyethylene glycol terephthalates and the melamino-formaldehyde resins in the mixed solvent to form a resin solution, mixing with the coloring agent, uniformly stirring to form a paint, pouring into a sand mill, grinding and dispersing until the fineness is 5 microns, adding the inorganic filler, and uniformly and stably stirring to obtain the coating. Compared with the general coating, the thermosetting heat conduction and radiation coating disclosed by the invention has the advantages that the heat conduction and radiation effect is remarkably improved and the production cost is reduced.

Description

Technical field [0001] The present invention involves a heat -conducting heat dissipation coating and its preparation methods, and more specifically a heat -curing heat -conducting heat dissipation coatings and its preparation methods. Background technique [0002] Domestic high -power density electronic industrial devices develop in the direction of small size, compact structure, and diversification of functional diversification. The heating and cooling problem caused by it has seriously affected the stability and reliability of high -power electronic devices.At present, the thermal control used on electronic devices is generally used in metal materials, but the quality of such materials and large thermal expansion coefficients have greatly limited their widely used use as packaging heat dissipation materials.Therefore, research and development of new materials with thinnerization, light quality, and high heating rate is of great significance for the lightweight and efficient op...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D167/02C09D161/28C09D7/12
Inventor 游建章
Owner JIANG SU YOUNG KING ELECTRONICS
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