High modulus composition for emi shielding and molded articles thereof

A technology of electromagnetic shielding and composition, applied in the field of its molded products, can solve the problems of surface peeling, cost increase, etc.

Inactive Publication Date: 2013-03-20
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] To solve such problems, in general high-rigidity resins whose surface resistance has been reduced by conductive plating, cost increases due to plating and subsequent processing, and surface peeling occurs after long-term use

Method used

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  • High modulus composition for emi shielding and molded articles thereof
  • High modulus composition for emi shielding and molded articles thereof
  • High modulus composition for emi shielding and molded articles thereof

Examples

Experimental program
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Embodiment 1-8

[0125] The polyamide resins, metal fillers, and other additives listed in Table 1 were mixed in a typical mixer and extruded using a twin-screw extruder with L / D=35, φ=45mm to prepare pellet form Extrusion. The pellets were melted using a long shaft extruder. Then, the carbon fiber (B) was impregnated by a pultrusion method, followed by cutting into long pellets having a length of 12 mm. Test pieces for evaluation of applicability such as physical properties and EMI resistance at an injection temperature of 270° C. were prepared by injection molding to prepare long fibers. These test pieces were kept at 23° C. and 50% RH (relative humidity) for 48 hours, and then the physical properties were measured as follows. The results are shown in Table 1.

[0126] Evaluation of physical properties:

[0127] (1) Tensile strength: The tensile strength was evaluated at 5 mm / min according to ASTM D638. The unit of tensile strength is expressed in MPa.

[0128] (2) Flexural modulus: Th...

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Abstract

The high-rigidity electromagnetic shielding composition of the present invention comprises: (A) approximately 10-34 wt% of polyamide resin having an aromatic group in the backbone structure; (B) approximately 65-85 wt% of carbon fiber; and (C) approximately 1-20 wt% of metallic filler. The composition has high modulus, electromagnetic shielding effects, and high surface conductance, and can thus be used to replace frames, brackets and the like for electronic devices.

Description

technical field [0001] This invention relates to highly rigid electromagnetic shielding compositions and molded articles thereof. More specifically, the present invention relates to a high-rigidity electromagnetic shielding composition, which has excellent mechanical strength, electromagnetic interference (EMI) shielding performance, and excellent processability, can reduce manufacturing cost by replacing existing magnesium materials, and relates to its mold products. Background technique [0002] Electromagnetic waves are noise phenomena caused by electrostatic discharge, and are known to cause not only noise and malfunction of surrounding parts or equipment but also have harmful effects on the human body. Recently, due to the increased use of electrical / electronic products with high efficiency, high power consumption, and high integration, the possibility of user exposure to electromagnetic radiation is rapidly increasing, and regulations on electromagnetic radiation have...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/10C08K7/04C08K3/08C08J5/04C08G69/32
CPCC08L77/10H01B1/20H01B1/24H05K9/009C08K3/04C08L77/06B32B5/16H01B1/22C08L77/00C08K3/08C08K7/06C08K3/041Y10T428/2998
Inventor 林润淑朴康烈申赞均朴志权金杜映
Owner CHEIL IND INC
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