Sn-Cu-Ni-Ce-Cr lead-free solder and preparation method thereof

A sn-cu-ni-ce-cr, lead-free solder technology, applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of reducing solder slag rate, poor oxidation resistance, etc. The effect of improving high temperature oxidation resistance, improving wetting properties, reducing the possibility of chemical corrosion and galvanic corrosion

Inactive Publication Date: 2013-03-27
郴州金箭焊料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to aim at the shortcoming of poor oxidation resistance of SnCuNiCe alloy solder, to propose a lead-free solder that maintains the original advan

Method used

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  • Sn-Cu-Ni-Ce-Cr lead-free solder and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Get 50kg of tin-copper alloy ingots described in the preparation method provided by the invention, 10kg of tin-chromium alloy ingots, 10kg of tin-cerium alloy ingots, 1.5kg of tin-nickel alloy ingots and 28.5kg of the insufficient tin amount of the poor surplus tin and add stainless steel pot Carry out smelting in, cast into lead-free solder, obtain the product of the present invention that is originally made by tin 92.85%, copper 5%, chromium 1%, cerium 1%, nickel 0.15%.

Embodiment 2

[0022] Get 40kg of tin-copper alloy ingots described in the preparation method provided by the invention, 8kg of tin-chromium alloy ingots, 0.8kg of tin-cerium alloy ingots, 0.8kg of tin-nickel alloy ingots and 50.4kg of insufficient tin amount to add surplus tin and add stainless steel The pot is melted and cast into lead-free solder to obtain the product of the present invention made of 95.04% tin, 4% copper, 0.8% chromium, 0.08% cerium and 0.08% nickel as raw materials.

Embodiment 3

[0024] Get 30kg of tin-copper alloy ingots described in the preparation method provided by the invention, 5kg of tin-chromium alloy ingots, 8kg of tin-cerium alloy ingots, 1.2kg of tin-nickel alloy ingots and 55.8kg of insufficient tin amount to add surplus tin and add stainless steel pot Smelting in the furnace, casting into lead-free solder, obtaining the product of the present invention made of 95.58% tin, 3% copper, 0.5% chromium, 0.8% cerium, and 0.12% nickel as raw materials.

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Abstract

The invention discloses a Sn-Cu-Ni-Ce-Cr lead-free solder which comprises the following components by weight percent: 0.5-5.0% of Cu, 0.06-1.0% of Cr, 0.01-1.0% of Ce, 0.01-0.15% of Ni and the balance of Sn. Further, the content of the Cr is 0.2-0.7% through optimization. The lead-free solder has the characteristics that the solder splash yield is high relative to a Sn-Cu-Ni-Ce solder, and the solder splash yield is increased by utilizing the properties of the Cr and adjusting the Cr content, so that the lead-free solder with good mechanical properties, good wettability and strong antioxidant ability are obtained, and can be widely applied to the technical field of electronic materials.

Description

technical field [0001] The invention relates to a tin-copper-based lead-free solder, in particular to a Sn-Cu-Ni-Ce-Cr lead-free solder. Background technique [0002] In the lead-free process of solder, lead-free solders mainly include SnAg-based, SnCu-based, SnZn-based, SnBi-based binary alloys, and SnAgCu-based ternary alloys. Compared with traditional SnPb solders, there are inherent disadvantages. SnAg (SnAgCu) solder is better than SnPb solder in terms of fatigue resistance and tensile strength, and has good creep and ductility, but it has a high melting point, more silver content, high cost, and poor oxidation and corrosion resistance. . Compared with other lead-free solders, SnCu solder has the lowest cost, but has deficiencies in alloy melting point, soldering reliability, process yield and oxidation resistance. SnBi solder has a low melting point, superior tensile strength and creep properties, and good wettability, but the cost is high and thermal stabili...

Claims

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Application Information

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IPC IPC(8): B23K35/34B23K35/40
Inventor 胡洁李曼娇
Owner 郴州金箭焊料有限公司
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