Back silver paste for low-silver-content crystalline silicon solar battery and preparation method thereof
A technology of solar cells and silver content, which is used in cable/conductor manufacturing, circuits, electrical components, etc., can solve the problems of lack of market competitiveness of back silver paste and high metal silver price, and meet the requirements of solderability and adhesion. The effect of reducing production cost and reducing production burden
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Embodiment 1
[0016] 1. Metal conductive powder
[0017] A spherical silver-coated copper powder with a structure of core-shell coating, a silver content of 40%, and a particle size of 1.2 μm was selected.
[0018] 2. Preparation of modified organic binder
[0019] Weigh 50% terpineol, 17% butyl carbitol, 20% butyl carbitol acetate, 5% ethyl cellulose, 3.5% organosilicon compound, 2% hydrogenated castor oil , 2.5% additives, the above materials are mixed and heated to 80 ° C for 100 minutes to dissolve, and a transparent colloid with good lubricity and printability is obtained.
[0020] 3. Preparation of inorganic binder metallic glass powder
[0021] Weigh 32.5% of B 2 o 3 , 30%% Bi 2 o 3 , 15% SiO 2 , 15% Al 2 o 3 , 5% ZnO, 2.5% PbF 2 . After mixing the above raw materials evenly with a mixer, put them into a ceramic crucible, dry them in an oven at 150°C for 2 hours, put them in a muffle furnace, melt them at 1000°C for 1 hour, and dry them after water quenching, then use a pl...
Embodiment 2
[0029] 1. Metal conductive powder
[0030] A spherical silver-coated copper powder with a structure of core-shell coating, a silver content of 35%, and a particle size of 1.0 μm was selected.
[0031] 2. Preparation of modified organic binder
[0032] Weigh 50% terpineol, 17% butyl carbitol, 20% butyl carbitol acetate, 5% ethyl cellulose, 3.5% organosilicon compound, 2% hydrogenated castor oil , 2.5% additives, the above materials are mixed and heated to 90 ° C for 100 minutes to dissolve, and a transparent colloid with good lubricity and printability is obtained.
[0033] 3. Preparation of glass powder
[0034] Weigh 32.5% of B 2 o 3 , 30%% Bi 2 o 3 , 15% SiO 2 , 15% Al 2 o 3 , 5% ZnO, 2.5% PbF 2 After mixing evenly with a mixer, put it into a ceramic crucible, dry it in an oven at 150°C for 2h, put it in a muffle furnace, melt it at 1100°C for 1h, and dry it after water quenching, then dry it with a planetary ball mill for 3h to obtain Metallic glass powder below ...
Embodiment 3
[0042] 1. Metal conductive powder
[0043] A spherical silver-coated copper powder with a structure of core-shell coating, a silver content of 40%, and a particle size of 1.2 μm was selected.
[0044] 2. Preparation of modified organic binder
[0045] Weigh 50% terpineol, 17% butyl carbitol, 20% butyl carbitol acetate, 5% ethyl cellulose, 3.5% organosilicon compound, 2% hydrogenated castor oil , 2.5% additives, the above materials are mixed and heated to 100 ℃ to dissolve 100min, to obtain a transparent colloid with good lubricity and printability.
[0046] 3. Preparation of glass powder
[0047] Weigh 20% of B 2 o 3 , 50% Bi2O3, 10% SiO 2 , 12% Al 2 o 3 , 5% ZnO, 3.0% PbF 2 After mixing evenly with a mixer, put it into a ceramic crucible, dry it in an oven at 150°C for 2h, put it in a muffle furnace, melt it at 1200°C for 1h, and dry it after water quenching, then use a planetary ball mill for 3h, and dry it to get Metallic glass powder below 5μm.
[0048] 4. Prepar...
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