Multilayer printed circuit board and manufacturing method thereof

Abstract

The invention relates to a manufacturing method for a multilayer printed circuit board. The method comprises steps of providing at least two single-layer printed circuit boards which respectively comprise a substrate and a copper layer arranged on the surface of the substrate which is made of polymethyl methacrylate materials; providing at least one bonding layer and enabling the single-layer printed circuit boards and the bonding layer to be stacked in stagger; and conducting thermocompression bonding on a stack structure of the single-layer printed circuit boards and the bonding layer, enabling the two single-layer printed circuit boards to be tightly bonded through the bonding layer and forming the multilayer printed circuit board. The invention further provides the multilayer printed circuit board manufactured by using the manufacturing method for the multilayer printed circuit board. The multilayer printed circuit board and the manufacturing method have the advantages of being excellent in electric and mechanical performance, wide in applicable scope, low in cost and simple in manufacture method.

Description

technical field [0001] The invention relates to a multilayer printed circuit board and its manufacturing method, in particular to a multilayer printed circuit board with PMMA (polymethyl methacrylate) as the substrate and thermoplastic polyurethane elastomer as the adhesive layer and its manufacturing method . Background technique [0002] Printed Circuit Board (PCB) is the basis of almost any electronic product. With the rapid development of the electronics industry, printed circuit boards, as the basic components of electronic products, are more and more widely used. Although the functions of electronic products are not only enhanced, the application With the expansion of the field, especially driven by the development of the high-speed information age, there are more and more requirements for printed circuit boards used in electronic products, especially the requirements for printed circuit boards in terms of signal transmission quality and speed. constantly improving. ...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, epoxy resin as the main body (FR-4) is currently the largest and most widely used type of product for printed circuit boards. However, printed circuit boards made of FR-4 materials have high cost and large dielectric loss. And the electrical performance is poor, and FR-4 has a series of shortcomings such as easy water absorption, easy aging, and poor voltage resistance, which makes the printed circuit boards made of it not suitable for special environments, especially humid environments, aerospace, high-speed, etc. Communications, space or radioactive medical devices) and other fields require materials with light density, low transmission dielectric loss, strong corrosion resistance, environmental protection, and high insulation.

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