Wafer-level lens module array, array combination and manufacturing methods thereof

Abstract

The invention provides a wafer-level lens module array, a wafer-level lens module array combination and manufacturing methods thereof. The wafer-level lens module array comprises a transparent substrate and a through hole substrate, as well as at least one of a first lens array and a second lens array, wherein the transparent substrate is provided with a first surface and a second surface; the through hole substrate is located on the first surface of the transparent substrate; the through hole substrate comprises multiple through holes; the through holes expose a part of the first surface of the transparent substrate; the first lens array is located at the through holes in the through hole substrate; and the second lens array is located at the second surface of the transparent substrate. The wafer-level lens module array provided by the invention is simple in structure and applicable for mass production, thereby having wide market prospect.

Description

technical field [0001] The invention relates to a lens module, in particular to a wafer-level lens module array, an array combination, and a method for manufacturing the two. Background technique [0002] In recent years, portable terminals of electronic devices such as mobile phones or PDAs (Personal Digital Assistant) are usually equipped with camera units. Such an imaging unit generally includes a solid-state imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) image sensor, and a lens for forming a subject image on the solid-state imaging element. [0003] Along with the downsizing and thinning of portable terminals, the lens is also required to be downsized and thinned. Furthermore, in order to reduce the cost of the portable terminal, it is desired to improve the efficiency of the manufacturing process of the lens. As a method of manufacturing such small and numerous lenses, it is common to form a wafe...

AI Technical Summary

Problems solved by technology

In this case, regardless of whether the material used for the lens array and the material used for the substrate are the same, when the molding material is supplied to the mold, air is mixed into the molding material, resulting in a change in the shape of the lens head after molding, which inevitably affects the Optical performance of the lens

In addition, the compression molding process needs to increase the temperature to above 200°C to ensure that the compression molding temperature reaches above the glass transition temperature of the solid resin, so more energy consumption is required and the cost is higher

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