Wafer-level lens module array, array combination and manufacturing methods thereof

A lens module and lens array technology, applied in radiation control devices, installation, optics, etc., can solve the problems of affecting the optical performance of the lens, air mixing, and high energy consumption, and achieve a simple structure, smooth mirror surface, and broad market prospects. Effect

Inactive Publication Date: 2013-04-17
GALAXYCORE SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, regardless of whether the material used for the lens array and the material used for the substrate are the same, when the molding material is supplied to the mold, air is mixed into the molding material, resulting in a change in the shape of the lens head after molding, which inevitably affects

Method used

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  • Wafer-level lens module array, array combination and manufacturing methods thereof
  • Wafer-level lens module array, array combination and manufacturing methods thereof
  • Wafer-level lens module array, array combination and manufacturing methods thereof

Examples

Experimental program
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Example Embodiment

[0070] Embodiment one

[0071] Please refer to figure 1 , figure 1 It is a schematic diagram of a wafer-level lens module array provided by Embodiment 1 of the present invention. The wafer-level lens module array includes a transparent substrate 110 . The material of the transparent substrate 110 may include but not limited to a transparent glass substrate or a transparent resin substrate, and other materials having corresponding mechanical strength and optical properties and suitable for the manufacturing process of the present invention may also be used to make the transparent substrate 110 . The transparent substrate 110 has a first surface and a second surface, figure 1 Although the first surface and the second surface are not marked in , they can be regarded as corresponding figure 1 The upper surface and the lower surface of the transparent substrate 110.

[0072] Located on the first surface (ie, the upper surface) of the transparent substrate 110 is a through-hole...

Example Embodiment

[0078] Embodiment two

[0079] Please refer to figure 2 , figure 2 It is a schematic diagram of the wafer-level lens module array provided by Embodiment 2 of the present invention. Most of the structure of the wafer-level lens module array provided in this embodiment is the same as that of the wafer-level lens module array described in Embodiment 1. Therefore, this description only describes the differences between the two.

[0080] like figure 2 As shown, in this embodiment, the first lens array is located at the opening of the through hole 121, that is, the first lens array composed of the first lens 130 is not located on the through-hole substrate 120 and the transparent substrate 110 formed by pasting. The bottom of the through hole 121 is located at the opening of the through hole 121 . from figure 2 It can be seen from the figure that each first lens 130 is partially located inside the through hole 121 , so that the first lens 130 can be fixed at the opening of ...

Example Embodiment

[0082] Embodiment Three

[0083] Please refer to image 3 , image 3 It is a schematic diagram of the wafer-level lens module array provided by Embodiment 3 of the present invention. In this embodiment, the wafer-level lens module array includes a through-hole substrate 220, and the through-hole substrate 220 includes a plurality of through holes 221 ( image 3 The through hole 221 has been filled with a flat filling layer 270, and its structure can be referred to Figure 4 shown). The through-hole substrate 220 in this embodiment is similar to the through-hole substrate 120 in the first embodiment, so its manufacturing material can also be the same as the through-hole substrate 120 in the first embodiment, that is, the through-hole substrate 220 includes but is not limited to BT board, Glass, ceramic or polyimide plates.

[0084] In this embodiment, the wafer-level lens module array also includes at least one of a first lens array and a second lens array, wherein the fir...

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Abstract

The invention provides a wafer-level lens module array, a wafer-level lens module array combination and manufacturing methods thereof. The wafer-level lens module array comprises a transparent substrate and a through hole substrate, as well as at least one of a first lens array and a second lens array, wherein the transparent substrate is provided with a first surface and a second surface; the through hole substrate is located on the first surface of the transparent substrate; the through hole substrate comprises multiple through holes; the through holes expose a part of the first surface of the transparent substrate; the first lens array is located at the through holes in the through hole substrate; and the second lens array is located at the second surface of the transparent substrate. The wafer-level lens module array provided by the invention is simple in structure and applicable for mass production, thereby having wide market prospect.

Description

technical field [0001] The invention relates to a lens module, in particular to a wafer-level lens module array, an array combination, and a method for manufacturing the two. Background technique [0002] In recent years, portable terminals of electronic devices such as mobile phones or PDAs (Personal Digital Assistant) are usually equipped with camera units. Such an imaging unit generally includes a solid-state imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) image sensor, and a lens for forming a subject image on the solid-state imaging element. [0003] Along with the downsizing and thinning of portable terminals, the lens is also required to be downsized and thinned. Furthermore, in order to reduce the cost of the portable terminal, it is desired to improve the efficiency of the manufacturing process of the lens. As a method of manufacturing such small and numerous lenses, it is common to form a wafe...

Claims

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Application Information

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IPC IPC(8): H01L27/146G02B7/02G03B30/00
Inventor 邓辉夏欢
Owner GALAXYCORE SHANGHAI
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