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Latent curing agent composition and one-part curable epoxy resin composition

A hardener composition and compound technology are applied in the fields of latent hardener compositions and one-liquid hardening epoxy resin compositions, which can solve the problems of lack of storage stability and latent hardeners, etc. Excellent curability and adhesion

Active Publication Date: 2013-04-24
ADEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The use of an amine hardener as a hardener for this kind of composite resin has also been proposed (Patent Document 3), but this also has the disadvantage of "sufficient storage stability"
[0009] In particular, in the application of electronic components such as small motors and drivers, although high adhesiveness is required, one-component curable resin compositions using epoxy resins and epoxy-cyanate composite resins that meet these requirements are suitable. potential hardeners of

Method used

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  • Latent curing agent composition and one-part curable epoxy resin composition
  • Latent curing agent composition and one-part curable epoxy resin composition
  • Latent curing agent composition and one-part curable epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1～6

[0076] Manufacture of phenolic resin (PR1~PR6)

[0077] In a four-necked separable flask equipped with a thermometer, a stirring device, a dropping device, and a cooling tube, add phenol, 50% formalin aqueous solution, and oxalic acid, heat, and react at reflux temperature for 4 hours. After the reflux reaction, heat it up to 160°C under normal pressure and concentrate it for 3 hours, then keep it at 160°C and reduce the pressure to 20-30 torr, and concentrate under reduced pressure until the distillate no longer comes out , and yellow-brown phenol resins (PR1 to PR6) having a molecular weight distribution shown in the following [Table 1] were obtained.

[0078] After dissolving 0.01 g of each of the obtained samples in 10 g of THF, gel permeation chromatography (gel permeation chromatography) (Shodex GPC-101 manufactured by Showa Denko Co., Ltd.) was used. Shodex KF-802 was used as the sample column for measurement, Shodex KF-800RH manufactured by Showa Denko Co., Ltd. was u...

Embodiment 1

[0083] In a flask equipped with a thermometer, a cooling device, a stirring device, a dropping device and a dehydration device, add 300 g of propylene glycol monomethyl ether and 100 g of N,N-diethylaminopropylamine, and raise the temperature of the reaction system to 70-75 °C, 213 g of Adeka Resin EP-4100E (trade name of ADEKA Co., Ltd.: Bisphenol A type epoxy resin, epoxy equivalent 190) was added dropwise. After the dripping is completed, mature at 110-130°C for 1 hour, and spend 1 hour at 110-130°C under normal pressure, and spend 1 hour at 175-185°C at 20-30 Torr to remove the solvent. Then, 210 g of phenolic resin PR1 was added in batches at 175 to 185° C., while dissolving the phenolic resin. Furthermore, it degassed under reduced pressure at 180-190 degreeC, 20-30 torr for 1 hour, and obtained the hardening|curing agent composition (HC-1). The obtained curing agent composition was ground in a mortar, and the melting point was 85° C. when measured using a melting point...

Embodiment 2

[0085] Except having used 74 g of 1,2-diaminopropane instead of 100 g of N,N-diethylaminopropylamine, it reacted and processed similarly to Example 1, and obtained the hardening|curing agent composition (HCH-1). The obtained curing agent composition was ground in a mortar, and the melting point was 91° C. when measured using a melting point measuring device manufactured by Yanaco Corporation.

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Abstract

The present invention is a latent curing agent composition comprising (A) an adduct obtained by reacting (a) an amine compound having an active hydrogen group and (b) a polyglycidyl compound, and (B) a curing agent composition for epoxy resin containing phenol resin, characterized in that the phenol resin comprises 10 to 40 mass% of a dikaryon, and the number average molecular weight (Mn) is 900 to 2,000, the weight average molecular weight (Mw) is 2,500 to 5,000, and the molecular weight distribution (Mw / Mn) is 2.0 to 4.0.

Description

technical field [0001] The present invention relates to a latent hardener composition suitable for using polyepoxides and / or cyanate esters, and specifically relates to a latent hardener composition containing an addition reactant obtained by reacting an amine compound and a polyglycidyl compound , and a latent hardener composition composed of a phenolic resin with an optimized molecular weight that is stable at room temperature and can function as a hardener when heated, and a one-component hardening epoxy resin containing the latent hardener composition combination. Background technique [0002] Epoxy resin has excellent adhesion to various substrates, and since the hardened product formed by hardening the epoxy resin with a hardener has relatively excellent heat resistance, chemical resistance, electrical properties, and mechanical properties, it can be It can be used in a wide range of industrial fields, especially, it can be used commercially in the fields of coatings ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/40C08L63/00C08L61/06C08K5/315
CPCC08G59/184C08L61/06C08G59/50C08K9/10C08L63/00C08G59/621C08G59/40C08K5/315
Inventor 小川亮横田谦介正宗叶子
Owner ADEKA CORP
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