High thermal conductivity carbon fiber resin-based composite material and preparation method thereof

Abstract

The invention relates to a high thermal conductivity carbon fiber resin-based composite material and a preparation method thereof. According to the technical scheme, intermediate phase pitch based carbon fibers are taken as a heat conduction reinforcing material, a polymer resin is taken as a substrate material, and the volume packing rate of the intermediate phase pitch based carbon fibers is 10-60 percent. The preparation method comprises the following steps: uniformly coating the polymer resin on surfaces of intermediate phase pitch based carbon fiber filaments; unidirectionally paving or orthogonally paving in a cross shape in a mold; and performing casting moulding or hot press moulding to obtain the high thermal conductivity carbon fiber resin-based composite material. The preparation process is simple and high in repeatability; the internal carbon fibers of the prepared high thermal conductivity carbon fiber resin-based composite material have a high orientation arrangement structure, and the thermal diffusion coefficient and the thermal conductivity along the length direction of the fibers can be controlled in a range of 50-400mm<2> / s and a range of 80-500W / m.k according to the difference of carbon fiber filling amount. Therefore, the product has the characteristics of high orientation and high thermal conductivity, and the electrical and mechanical properties along the axial direction of the fibers can be obviously improved.

Description

technical field [0001] The invention belongs to the technical field of resin-based composite materials. In particular, it relates to a high thermal conductivity carbon fiber resin-based composite material and a preparation method thereof. Background technique [0002] In the field of microelectronics technology, due to the increasing integration of electronic circuits, the accumulation of heat will lead to an increase in the temperature of the device, resulting in a decrease in operating stability. According to statistics, every time the temperature of electronic components rises by 2 o C, the reliability drops by 10%, and the temperature rises by 50 o The lifetime of C is only a 25% increase in temperature o 1 / 6 of C life. Therefore, in order to ensure the normal operation of electronic components with high reliability for a long time, the heat conduction and heat dissipation capabilities of materials become important limiting factors affecting their service life. [0...

AI Technical Summary

Problems solved by technology

Therefore, new heat-conducting materials made of these traditional heat-conducting substances as heat-conducting fillers compounded with polymer resins or plastics have been widely used, such as "a polymer heat-conducting composite material and its preparation method" (CN10192489A), "a kind of Long carbon fiber reinforced high thermal conductivity polymer composite material and its preparation method” (CN102477182A), “high thermal conductivity plastic and its preparation method” (CN201110137817X) and “a thermal conductivity plastic and its preparation method” (CN102746560A) and other patent technologies, but the above The room temperature thermal conductivity of the materials prepared by the technology is generally low, only 2~10W / m·K